AMD_XCVM1802-2MSEVSVD1760
original

AMD
XCVM1802-2MSEVSVD1760

777-XCVM1802-2MSEVSVD1760
IC VERSAL AICORE FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
726
Peripherals
DDR, DMA, PCIe
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XCVM1802-2MSEVSVD1760 Description

XCVM1802-2MSEVSVD1760 Description

The XCVM1802-2MSEVSVD1760 is a high-performance System on Chip (SoC) from AMD, specifically designed for complex computing and processing tasks. This IC belongs to the Versal™ Prime series, known for its advanced architecture and extensive capabilities. The XCVM1802-2MSEVSVD1760 features a dual-core processor with speeds of 600MHz and 1.4GHz, offering robust performance for demanding applications. It integrates a powerful Field Programmable Gate Array (FPGA) with 1.9M logic cells, providing flexibility and adaptability for various use cases.

XCVM1802-2MSEVSVD1760 Features

  • Dual-Core Processor: The XCVM1802-2MSEVSVD1760 features a dual-core processor with speeds of 600MHz and 1.4GHz, ensuring high computational efficiency-.
    FPGA Integration: Equipped with an FPGA containing 1.9M logic cells, this SoC offers unparalleled flexibility and adaptability for custom processing tasks.
  • Operating Temperature: Designed to operate within a wide temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions.
  • Memory and I/O: The device includes 256KB of RAM and 726 I/O pins, providing ample memory and connectivity options.
  • Peripheral Support: It supports a wide range of peripherals, including DDR, DMA, PCIe, CANbus, EBI/EMI, Ethernet, I2C, MMC/SDSD/IO, SPI, UART/USART, and USB OTG, enhancing its versatility.
  • Package and Compliance: The XCVM1802-2MSEVSVD1760 is available in a tray package and is ROHS3 compliant, ensuring environmental sustainability.
  • Moisture Sensitivity Level: With an MSL rating of 4 (72 hours), it is well-suited for manufacturing processes requiring extended exposure to moisture.

XCVM8102-2MSEVSVD1760 Applications

The XCVM1802-2MSEVSVD1760 is ideal for applications requiring high computational power and flexibility. Its dual-core processor and FPGA integration make it suitable for:

  • Advanced Computing: Ideal for high-performance computing tasks, such as data processing and analytics.
  • Embedded Systems: Perfect for embedded systems where flexibility and adaptability are crucial.
  • Networking: Suitable for applications networking, including routers and switches, due to its extensive peripheral support.
  • Industrial Automation: The wide operating temperature range and robust performance make it ideal for industrial automation and control systems.
  • Telecommunications: Its support for communication various protocols makes it a valuable component in telecommunications infrastructure.

Conclusion of XCVM1802-2MSEVSVD1760

The XCVM1802-2MSEVSVD1760 stands out in the electronics industry due to its combination of high performance and flexibility. Its dual-core processor and FPGA integration offer a unique blend of computational power and adaptability, making it suitable for a wide range of applications. The extensive peripheral support and wide operating temperature range further enhance its versatility. For engineers and designers seeking a reliable and high-performance SoC, the XCVM1802-2MSEVSVD1760 an is excellent choice.

FAQ

What is XCVM1802-2MSEVSVD1760?
XCVM1802-2MSEVSVD1760 is a System On Chip (SoC) from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
What operating temperature range does XCVM1802-2MSEVSVD1760 support?
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