AMD_XCVU13P-2FSGA2577I
AMD_XCVU13P-2FSGA2577I
original

AMD
XCVU13P-2FSGA2577I

696-XCVU13P-2FSGA2577I
IC FPGA 448 I/O 2577FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
99090432
Number of LABs/CLBs
216000
ECCN
3A001A7B
Number of I/O
448
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2577-FCBGA (52.5x52.5)
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XCVU13P-2FSGA2577I Description

AMD's XCVU13P-2FSGA2577I is a high-performance integrated circuit (IC) designed for use in various applications, including industrial control systems, automotive electronics, and telecommunications equipment. This IC is part of AMD's extensive portfolio of products that cater to the needs of various industries.

Description:

The XCVU13P-2FSGA2577I is a System on Chip (SoC) device that combines a high-performance processor with various peripheral functions. It is manufactured using advanced semiconductor technology, ensuring high reliability and performance. The IC is available in a 2FSGA package, which is a compact and robust package type suitable for various applications.

Features:

  1. High-performance processor: The XCVU13P-2FSGA2577I features a powerful processor that can handle complex tasks and operations with ease. This makes it suitable for applications that require fast processing and high computational capabilities.
  2. Integrated peripherals: The IC comes with a range of integrated peripherals, including memory controllers, input/output (I/O) interfaces, and security features. These peripherals enable the IC to communicate with other components in a system and provide additional functionality.
  3. Advanced power management: The XCVU13P-2FSGA2577I incorporates advanced power management techniques to optimize power consumption and ensure efficient operation.
  4. Robust security features: The IC includes various security features to protect sensitive data and prevent unauthorized access.
  5. Compact and reliable package: The 2FSGA package ensures that the IC is compact, robust, and suitable for various applications.

Applications:

The XCVU13P-2FSGA2577I is suitable for a wide range of applications, including:

  1. Industrial control systems: The high-performance processor and integrated peripherals make the IC ideal for use in industrial control systems, where fast processing and reliable communication are crucial.
  2. Automotive electronics: The IC can be used in various automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and body control modules.
  3. Telecommunications equipment: The XCVU13P-2FSGA2577I can be used in telecommunications equipment, such as base stations, routers, and switches, where high-speed processing and reliable communication are essential.
  4. Networking devices: The IC is suitable for use in networking devices, such as switches, routers, and firewalls, where high-performance processing and secure communication are required.
  5. Consumer electronics: The XCVU13P-2FSGA2577I can also be used in consumer electronics, such as smart home devices, set-top boxes, and gaming consoles, where high-performance processing and multimedia capabilities are needed.

In summary, AMD's XCVU13P-2FSGA2577I is a versatile and high-performance integrated circuit designed for use in various applications. Its advanced features, such as a powerful processor, integrated peripherals, and robust security features, make it an ideal choice for industries that require reliable and efficient solutions.

FAQ

What package or case is XCVU13P-2FSGA2577I available in?
XCVU13P-2FSGA2577I is available in the 2577-BBGA, FCBGA package / case.
What operating temperature range does XCVU13P-2FSGA2577I support?
Is XCVU13P-2FSGA2577I currently in stock?
What is the mounting type of XCVU13P-2FSGA2577I?
What is XCVU13P-2FSGA2577I?
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