AMD_XCVU33P-1FSVH2104E
AMD_XCVU33P-1FSVH2104E

AMD
XCVU33P-1FSVH2104E  
FPGAs

AMD
XCVU33P-1FSVH2104E
696-XCVU33P-1FSVH2104E
IC FPGA 208 I/O 2104FCBGA
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XCVU33P-1FSVH2104E Description

AMD's XCVU33P-1FSVH2104E is a high-performance integrated circuit (IC) designed for use in a variety of applications, including industrial control systems, automotive electronics, and telecommunications infrastructure.

Description:

The XCVU33P-1FSVH2104E is a System on Chip (SoC) device that integrates a Xilinx UltraScale+ FPGA fabric with hard processor system (HBM) memory and various peripheral interfaces. It is manufactured using a 16nm process technology and is available in a flip-chip ball grid array (FCBGA) package.

Features:

Some of the key features of the XCVU33P-1FSVH2104E include:

  1. Xilinx UltraScale+ FPGA fabric: The device features a high-performance FPGA fabric that provides flexible and customizable logic resources for a wide range of applications.
  2. Hard processor system (HBM) memory: The device includes high-bandwidth memory (HBM) that provides high-speed data access and improved system performance.
  3. Peripheral interfaces: The device supports a variety of peripheral interfaces, including PCIe, Gigabit Ethernet, and UART, making it suitable for use in a wide range of applications.
  4. Advanced I/O technology: The device features advanced I/O technology that provides high-speed data transfer and improved signal integrity.
  5. Low power consumption: The device is designed to operate at low power consumption levels, making it suitable for use in energy-sensitive applications.

Applications:

The XCVU33P-1FSVH2104E is suitable for use in a variety of applications, including:

  1. Industrial control systems: The device can be used in industrial control systems to provide high-performance processing and flexible I/O capabilities.
  2. Automotive electronics: The device can be used in automotive electronics for applications such as advanced driver assistance systems (ADAS) and infotainment systems.
  3. Telecommunications infrastructure: The device can be used in telecommunications infrastructure for applications such as network processing and packet forwarding.
  4. Aerospace and defense: The device can be used in aerospace and defense applications for signal processing, data acquisition, and communication systems.
  5. High-performance computing: The device can be used in high-performance computing applications for data-intensive tasks such as machine learning and data analytics.

Overall, the XCVU33P-1FSVH2104E is a versatile and high-performance IC that offers a range of features and capabilities suitable for a wide range of applications.

Tech Specifications

Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)

XCVU33P-1FSVH2104E Documents

Download datasheets and manufacturer documentation for XCVU33P-1FSVH2104E

Ersa Virtex UltraScale+ FPGA Datasheet       UltraScale, Ultrascale+ FPGAs Specification      
Ersa XCVUxxP EOL 04/Dec/2023      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

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