AMD_XCVU13P-3FSGA2577E
AMD_XCVU13P-3FSGA2577E
original

AMD
XCVU13P-3FSGA2577E

696-XCVU13P-3FSGA2577E
IC FPGA 448 I/O 2577FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
99090432
Number of LABs/CLBs
216000
ECCN
3A001A7B
Number of I/O
448
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2577-FCBGA (52.5x52.5)
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XCVU13P-3FSGA2577E Description

AMD's XCVU13P-3FSGA2577E is a high-performance integrated circuit (IC) designed for use in various applications. Here is a description of the model, its features, and potential applications:

Description:

The XCVU13P-3FSGA2577E is a System on Chip (SoC) developed by AMD, a leading semiconductor company. This IC combines multiple components, such as a processor, memory, and input/output controllers, onto a single chip, making it an efficient and compact solution for various electronic systems.

Features:

  1. High-performance processor: The XCVU13P-3FSGA2577E features a powerful processor that can handle complex tasks and provide fast processing speeds.
  2. Integrated memory: The SoC includes integrated memory, which helps reduce the overall system footprint and improve performance.
  3. Multiple input/output options: The IC offers a variety of input/output options, including USB, PCIe, and other interfaces, making it suitable for a wide range of applications.
  4. Energy-efficient design: The XCVU13P-3FSGA2577E is designed to consume minimal power, making it an environmentally friendly choice for various applications.
  5. Compact form factor: The SoC's compact size makes it ideal for use in space-constrained applications.

Applications:

  1. Embedded systems: The XCVU13P-3FSGA2577E can be used in various embedded systems, such as industrial automation, medical devices, and transportation systems, where high performance and reliability are crucial.
  2. Gaming consoles: The powerful processor and integrated graphics make this SoC an excellent choice for gaming consoles, providing a seamless gaming experience.
  3. Networking equipment: The multiple input/output options and high-performance processor make the XCVU13P-3FSGA2577E suitable for networking equipment, such as routers and switches.
  4. Consumer electronics: The SoC can be used in various consumer electronics, such as smart TVs, set-top boxes, and home automation systems, offering a compact and energy-efficient solution.
  5. Edge computing: The XCVU13P-3FSGA2577E can be used in edge computing applications, where data processing and analytics are performed closer to the data source, reducing latency and improving performance.

In summary, AMD's XCVU13P-3FSGA2577E is a versatile and powerful System on Chip that offers a range of features, making it suitable for various applications, including embedded systems, gaming consoles, networking equipment, consumer electronics, and edge computing. Its compact form factor, energy-efficient design, and high-performance capabilities make it an attractive choice for developers and engineers looking for a reliable and efficient solution.

FAQ

What package or case is XCVU13P-3FSGA2577E available in?
XCVU13P-3FSGA2577E is available in the 2577-BBGA, FCBGA package / case.
What operating temperature range does XCVU13P-3FSGA2577E support?
What is the mounting type of XCVU13P-3FSGA2577E?
Does XCVU13P-3FSGA2577E have quantity-based pricing?
Is XCVU13P-3FSGA2577E currently in stock?
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