AMD_XCVU27P-3FIGD2104E
AMD_XCVU27P-3FIGD2104E
original

AMD
XCVU27P-3FIGD2104E

696-XCVU27P-3FIGD2104E
IC FPGA 676 I/O 2104FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
74344038
Number of LABs/CLBs
162000
ECCN
3A001A7B
Number of I/O
676
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2104-FCBGA (52.5x52.5)
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XCVU27P-3FIGD2104E Description

AMD's XCVU27P-3FIGD2104E is a high-performance integrated circuit designed for use in a variety of applications. This model is a member of AMD's Xilinx product line, which is known for its advanced programmable logic solutions.

Description:

The XCVU27P-3FIGD2104E is a Field Programmable Gate Array (FPGA) device that features a high-density architecture and advanced I/O capabilities. It is built on a 16 nm technology node and offers a combination of logic elements, memory, and digital signal processing (DSP) resources. This device is available in a flip-chip ball grid array (FCBGA) package, which provides a high level of integration and reliability.

Features:

Some of the key features of the XCVU27P-3FIGD2104E include:

  1. High-density architecture: The device offers a high number of logic elements, memory blocks, and DSP slices, making it suitable for complex and demanding applications.
  2. Advanced I/O capabilities: The FPGA features a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O capabilities.
  3. Low power consumption: The device is designed to operate at low power levels, making it ideal for energy-efficient applications.
  4. High performance: The FPGA offers high-speed processing and data transfer capabilities, making it suitable for high-performance applications.
  5. Programmable logic: The device can be programmed to perform a wide range of functions, making it highly versatile and customizable.

Applications:

The XCVU27P-3FIGD2104E is suitable for a wide range of applications, including:

  1. Telecommunications: The device can be used in telecommunications infrastructure, such as base stations, routers, and switches.
  2. Networking: The FPGA can be used in networking applications, such as data centers, enterprise networks, and service provider networks.
  3. Industrial automation: The device can be used in industrial automation systems, such as machine control, robotics, and process control.
  4. Military and aerospace: The FPGA can be used in military and aerospace applications, such as radar systems, satellite communication, and electronic warfare.
  5. Automotive: The device can be used in automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems.

In summary, the XCVU27P-3FIGD2104E is a high-performance FPGA device from AMD's Xilinx product line. It offers a high-density architecture, advanced I/O capabilities, low power consumption, and high performance, making it suitable for a wide range of applications in various industries.

FAQ

What operating temperature range does XCVU27P-3FIGD2104E support?
XCVU27P-3FIGD2104E has an operating temperature range of 0°C ~ 100°C (TJ).
Are there related or alternative parts for XCVU27P-3FIGD2104E?
What voltage specification is listed for XCVU27P-3FIGD2104E?
Is XCVU27P-3FIGD2104E currently in stock?
What is the standard lead time for XCVU27P-3FIGD2104E?
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