AMD
XCVU23P-3FSVJ1760E

696-XCVU23P-3FSVJ1760E
IC FPGA VIRTEX-UP 1760FCBGA
23 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
77909197
Number of LABs/CLBs
128700
ECCN
3A001A7B
Number of I/O
644
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
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XCVU23P-3FSVJ1760E Description

AMD's XCVU23P-3FSVJ1760E is a high-performance integrated circuit (IC) designed for use in a variety of applications. This IC is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and versatile solutions.

Description:

The XCVU23P-3FSVJ1760E is a field-programmable gate array (FPGA) that offers a combination of high performance, low power consumption, and advanced features. This IC is built using 16 nm technology and features a high-density architecture, making it ideal for use in complex and demanding applications.

Features:

Some of the key features of the XCVU23P-3FSVJ1760E include:

  1. High-performance processing capabilities: The IC is equipped with a powerful processing unit that can handle complex algorithms and data processing tasks with ease.
  2. Low power consumption: The IC is designed to operate at low voltage levels, which helps to minimize power consumption and reduce overall system costs.
  3. Versatile I/O options: The IC offers a wide range of I/O options, including high-speed serial transceivers and multi-gigabit transceivers, making it suitable for use in a variety of applications.
  4. Advanced security features: The IC includes advanced security features, such as encryption and authentication, to protect sensitive data and ensure the integrity of the system.
  5. High-density architecture: The IC is built using a high-density architecture, which allows for more functionality to be packed into a smaller form factor.

Applications:

The XCVU23P-3FSVJ1760E is suitable for use in a wide range of applications, including:

  1. Telecommunications: The IC can be used in telecommunications infrastructure, such as base stations and routers, to provide high-speed data processing and networking capabilities.
  2. Industrial automation: The IC can be used in industrial automation systems to provide real-time control and monitoring of manufacturing processes.
  3. Automotive: The IC can be used in advanced driver assistance systems (ADAS) and other automotive applications to provide high-performance processing capabilities.
  4. Aerospace and defense: The IC can be used in aerospace and defense applications, such as radar systems and satellite communications, to provide high-speed data processing and networking capabilities.
  5. Data centers: The IC can be used in data centers to provide high-performance processing capabilities for cloud computing and other data-intensive applications.

Overall, the XCVU23P-3FSVJ1760E is a versatile and powerful FPGA that offers a range of features and capabilities suitable for use in a variety of applications.

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