AMD_XCVU23P-L2FSVJ1760E
original

AMD
XCVU23P-L2FSVJ1760E

696-XCVU23P-L2FSVJ1760E
IC FPGA VIRTEX-UP LP 1760FCBGA
23 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 110°C (TJ)
Total RAM Bits
77909197
Number of LABs/CLBs
128700
ECCN
3A001A7B
Number of I/O
644
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
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XCVU23P-L2FSVJ1760E Description

The XCVU23P-L2FSVJ1760E is a high-performance field programmable gate array (FPGA) from AMD. This device is designed for use in a wide range of applications, including telecommunications, military and aerospace, industrial, and consumer electronics.

Description:

The XCVU23P-L2FSVJ1760E is a member of the Xilinx UltraScale+ family of FPGAs. It features a high-density architecture, with up to 2.3 million logic cells and 3,840 digital signal processing (DSP) slices. The device also includes a range of high-speed I/O interfaces, including PCIe Gen 4, Gigabit Ethernet, and DDR4 memory interfaces.

Features:

Some of the key features of the XCVU23P-L2FSVJ1760E include:

  1. High-density architecture: With up to 2.3 million logic cells and 3,840 DSP slices, the XCVU23P-L2FSVJ1760E is well-suited for complex designs.
  2. High-speed I/O interfaces: The device includes a range of high-speed interfaces, including PCIe Gen 4, Gigabit Ethernet, and DDR4 memory interfaces.
  3. Advanced DSP capabilities: The XCVU23P-L2FSVJ1760E includes a range of advanced DSP capabilities, including support for floating-point operations and hardware acceleration.
  4. Low power consumption: The device is designed to operate at low power levels, making it suitable for use in power-sensitive applications.
  5. High reliability: The XCVU23P-L2FSVJ1760E is designed for use in harsh environments and includes features such as error-correcting code (ECC) memory and built-in self-test (BIST) capabilities.

Applications:

The XCVU23P-L2FSVJ1760E is suitable for a wide range of applications, including:

  1. Telecommunications: The high-speed I/O interfaces and advanced DSP capabilities make the XCVU23P-L2FSVJ1760E well-suited for use in telecommunications equipment, such as base stations and routers.
  2. Military and aerospace: The high reliability and ruggedness of the XCVU23P-L2FSVJ1760E make it suitable for use in military and aerospace applications, such as radar systems and satellite communications.
  3. Industrial: The low power consumption and high reliability of the XCVU23P-L2FSVJ1760E make it suitable for use in industrial applications, such as motor control and robotics.
  4. Consumer electronics: The high-performance capabilities of the XCVU23P-L2FSVJ1760E make it suitable for use in consumer electronics, such as gaming consoles and high-definition video processing.

Overall, the XCVU23P-L2FSVJ1760E is a high-performance FPGA that offers a range of advanced features and capabilities, making it suitable for use in a wide range of applications.

FAQ

What package or case is XCVU23P-L2FSVJ1760E available in?
XCVU23P-L2FSVJ1760E is available in the 1760-BBGA, FCBGA package / case.
What is the mounting type of XCVU23P-L2FSVJ1760E?
What is the standard lead time for XCVU23P-L2FSVJ1760E?
What operating temperature range does XCVU23P-L2FSVJ1760E support?
Does XCVU23P-L2FSVJ1760E have quantity-based pricing?
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