AMD's XCVU5P-1FLVB2104E is a high-performance integrated circuit designed for a variety of applications. Here's a description of the model, its features, and potential applications:
Description:
The XCVU5P-1FLVB2104E is an advanced System on Chip (SoC) developed by AMD, a leading semiconductor company. This model is designed to deliver exceptional performance, power efficiency, and versatility for a wide range of applications.
Features:
High-performance CPU and GPU: The XCVU5P-1FLVB2104E integrates a powerful CPU and GPU, providing exceptional processing capabilities for compute-intensive tasks and graphics rendering.
Heterogeneous System Architecture (HSA): This model leverages AMD's HSA technology, enabling efficient communication between the CPU and GPU for optimal performance and power efficiency.
Advanced memory interface: The SoC supports high-speed memory interfaces, such as DDR4 and HBM2, ensuring fast data access and improved overall system performance.
I/O and connectivity options: The XCVU5P-1FLVB2104E offers a wide range of I/O and connectivity options, including PCIe, USB, and Ethernet, allowing seamless integration with various peripherals and external devices.
Security features: This model includes advanced security features, such as hardware-based encryption and secure boot, to protect sensitive data and ensure system integrity.
Power management: The SoC incorporates advanced power management techniques, allowing it to operate efficiently across a wide range of power budgets.
Applications:
High-performance computing (HPC): The XCVU5P-1FLVB2104E is well-suited for HPC applications, such as scientific simulations, data analytics, and machine learning, where high computational power and efficiency are crucial.
Embedded systems: The versatility and power efficiency of this SoC make it an excellent choice for embedded systems in industries like aerospace, defense, and industrial automation.
Gaming and multimedia: The XCVU5P-1FLVB2104E can be used in gaming consoles, set-top boxes, and other multimedia devices, providing a seamless and immersive user experience.
Cloud computing: This model can be deployed in cloud servers and data centers, offering high-performance computing capabilities for various cloud-based applications and services.
Edge computing: The XCVU5P-1FLVB2104E is suitable for edge computing applications, where low-latency processing and real-time analytics are required.
Artificial intelligence (AI) and machine learning: The powerful CPU and GPU, along with advanced memory interfaces, make this SoC an ideal choice for AI and machine learning workloads.
In summary, AMD's XCVU5P-1FLVB2104E is a versatile and high-performance SoC that caters to a wide range of applications, from high-performance computing to embedded systems and AI. Its advanced features, such as heterogeneous system architecture, security, and power management, make it a compelling choice for various industries and use cases.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XCVU5P-1FLVB2104E Documents
Download datasheets and manufacturer documentation for XCVU5P-1FLVB2104E
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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