AMD_XCVU3P-3FFVC1517E
original

AMD
XCVU3P-3FFVC1517E

696-XCVU3P-3FFVC1517E
IC FPGA 520 I/O 1517FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
118067200
Number of LABs/CLBs
49260
ECCN
5A002A1
Number of I/O
520
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1517-FCBGA (40x40)
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XCVU3P-3FFVC1517E Description

The AMD XCVU3P-3FFVC1517E is a high-performance integrated circuit designed for use in a variety of applications. Here is a description of the model, its features, and potential applications:

Description:

The AMD XCVU3P-3FFVC1517E is a complex programmable logic device (CPLD) that combines the flexibility of programmable logic with the high performance of an application-specific integrated circuit (ASIC). This device is manufactured using advanced semiconductor technology and is available in a compact 1517-pin flip-chip ball grid array (FCBGA) package.

Features:

  1. High-density programmable logic: The XCVU3P-3FFVC1517E offers a high-density programmable logic fabric, allowing for the implementation of complex digital designs and functions.
  2. Advanced I/O capabilities: This device features a wide range of I/O options, including high-speed transceivers, making it suitable for use in high-speed data communication applications.
  3. On-chip memory: The XCVU3P-3FFVC1517E includes a variety of on-chip memory resources, such as block RAM and distributed RAM, to support data storage and processing requirements.
  4. Digital signal processing (DSP) blocks: The device incorporates dedicated DSP blocks, enabling it to perform high-speed mathematical operations and handle signal processing tasks efficiently.
  5. High-performance clock management: The XCVU3P-3FFVC1517E features advanced clock management capabilities, allowing for precise control of clock signals and synchronization of various system components.
  6. Low power consumption: This device is designed to operate with low power consumption, making it suitable for use in energy-efficient systems.
  7. Robust design and reliability: The AMD XCVU3P-3FFVC1517E is built using advanced semiconductor processes, ensuring high reliability and long-term stability in various operating conditions.

Applications:

  1. High-speed communication systems: The XCVU3P-3FFVC1517E is well-suited for use in high-speed communication systems, such as telecom infrastructure, networking equipment, and data centers.
  2. Industrial control and automation: This device can be used in industrial control systems, including motor control, robotic systems, and process automation.
  3. Automotive systems: The XCVU3P-3FFVC1517E can be employed in various automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and powertrain control.
  4. Aerospace and defense: The device's high reliability and performance make it suitable for use in aerospace and defense applications, including navigation systems, communication systems, and electronic warfare equipment.
  5. Medical electronics: The XCVU3P-3FFVC1517E can be utilized in medical electronics, such as imaging systems, patient monitoring devices, and diagnostic equipment.
  6. Consumer electronics: This device can be used in consumer electronics, including smart home devices, wearable technology, and multimedia systems.

In summary, the AMD XCVU3P-3FFVC1517E is a versatile and powerful CPLD that offers a range of features and capabilities, making it suitable for a wide variety of applications across different industries.

FAQ

Are there related or alternative parts for XCVU3P-3FFVC1517E?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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Does XCVU3P-3FFVC1517E have quantity-based pricing?
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