AMD_XCVU3P-L2FFVC1517E
original

AMD
XCVU3P-L2FFVC1517E

696-XCVU3P-L2FFVC1517E
IC FPGA 520 I/O 1517FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 110°C (TJ)
Total RAM Bits
130355200
Number of LABs/CLBs
49260
ECCN
3A001A7B
Number of I/O
520
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1517-FCBGA (40x40)
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XCVU3P-L2FFVC1517E Description

The XCVU3P-L2FFVC1517E is a high-performance field-programmable gate array (FPGA) from AMD. This device is designed to provide advanced functionality and versatility for a wide range of applications, making it an ideal choice for engineers and developers working on complex and demanding projects.

Description:

The XCVU3P-L2FFVC1517E is a member of the Virtex UltraScale+ family of FPGAs from AMD. It is a high-density, low-power device that offers a combination of high-performance processing, advanced I/O capabilities, and flexible system integration options. This FPGA is built using 16 nm technology and features a large number of programmable logic resources, digital signal processing (DSP) blocks, and memory elements.

Features:

  1. High-performance processing: The XCVU3P-L2FFVC1517E offers a high level of computational power, making it suitable for applications that require intensive processing capabilities, such as data centers, high-performance computing, and advanced image and video processing.
  2. Advanced I/O capabilities: This FPGA features a wide range of high-speed I/O interfaces, including PCIe Gen 4, Gigabit Ethernet, and multi-protocol serializers/deserializers (SERDES), providing seamless connectivity with various peripheral devices and systems.
  3. Flexible system integration: The XCVU3P-L2FFVC1517E offers a variety of configuration and power management options, allowing for easy integration into different system architectures and form factors.
  4. Enhanced security: This FPGA includes advanced security features, such as encryption and authentication, to protect sensitive data and ensure the integrity of the system.
  5. Power efficiency: The XCVU3P-L2FFVC1517E is designed to consume low power, making it suitable for applications where power consumption is a critical factor, such as mobile devices and battery-powered systems.

Applications:

The XCVU3P-L2FFVC1517E is suitable for a wide range of applications due to its high performance, advanced I/O capabilities, and flexible system integration options. Some potential applications include:

  1. Data centers: The high-performance processing and advanced I/O capabilities of the XCVU3P-L2FFVC1517E make it an ideal choice for data center applications, such as high-speed data processing, storage, and networking.
  2. High-performance computing: The FPGA's computational power and programmability make it suitable for high-performance computing applications, such as scientific research, financial modeling, and complex simulations.
  3. Advanced image and video processing: The XCVU3P-L2FFVC1517E can be used in applications that require high-speed image and video processing, such as surveillance systems, medical imaging, and multimedia processing.
  4. Networking and communications: The FPGA's high-speed I/O interfaces and flexible system integration options make it suitable for networking and communications applications, such as routers, switches, and base stations.
  5. Industrial and automotive applications: The power efficiency and enhanced security features of the XCVU3P-L2FFVC1517E make it suitable for industrial and automotive applications, such as control systems, automation, and driver assistance systems.

FAQ

What operating temperature range does XCVU3P-L2FFVC1517E support?
XCVU3P-L2FFVC1517E has an operating temperature range of 0°C ~ 110°C (TJ).
Does XCVU3P-L2FFVC1517E have quantity-based pricing?
What package or case is XCVU3P-L2FFVC1517E available in?
Are there related or alternative parts for XCVU3P-L2FFVC1517E?
Is XCVU3P-L2FFVC1517E currently in stock?
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