AMD_XCVU7P-1FLVA2104E
original

AMD
XCVU7P-1FLVA2104E

696-XCVU7P-1FLVA2104E
IC FPGA 832 I/O 2104FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
260812800
Number of LABs/CLBs
98520
ECCN
3A001A7B
Number of I/O
832
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2104-FCBGA (47.5x47.5)
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XCVU7P-1FLVA2104E Description

AMD's XCVU7P-1FLVA2104E is a high-performance integrated circuit (IC) designed for use in a variety of applications. This IC is part of AMD's Xilinx product line and is based on the UltraScale+ architecture.

Description:

The XCVU7P-1FLVA2104E is a field programmable gate array (FPGA) that offers a high level of integration and flexibility. It features a 28 nm technology node and is designed to provide high performance and low power consumption. The IC is available in a flip-chip ball grid array (FCBGA) package, which allows for high-density packaging and improved thermal performance.

Features:

Some of the key features of the XCVU7P-1FLVA2104E include:

  1. High-performance processing resources: The FPGA offers a range of processing resources, including digital signal processing (DSP) blocks, memory blocks, and configurable logic blocks, to provide high levels of processing power and flexibility.
  2. High-bandwidth memory interface: The IC features a high-bandwidth memory interface that allows for efficient data transfer between the FPGA and external memory.
  3. Advanced I/O capabilities: The FPGA supports a wide range of I/O standards, including PCIe, Ethernet, and DDR, to provide high-speed connectivity and data transfer.
  4. Low power consumption: The IC is designed to provide low power consumption, making it suitable for use in power-sensitive applications.
  5. High-density packaging: The flip-chip ball grid array (FCBGA) package allows for high-density packaging, which can help to reduce the overall size and weight of the system.

Applications:

The XCVU7P-1FLVA2104E is suitable for a wide range of applications, including:

  1. High-performance computing: The FPGA can be used in high-performance computing applications, such as data centers, where high levels of processing power and low power consumption are required.
  2. Networking: The IC can be used in networking applications, such as routers and switches, where high-speed data transfer and low latency are critical.
  3. Signal processing: The FPGA can be used in signal processing applications, such as image and video processing, where high levels of processing power and flexibility are required.
  4. Embedded systems: The IC can be used in embedded systems, such as industrial control systems and automotive systems, where high reliability and low power consumption are important.
  5. Aerospace and defense: The FPGA can be used in aerospace and defense applications, such as radar systems and satellite communication systems, where high reliability and performance are critical.

Overall, the XCVU7P-1FLVA2104E is a versatile and powerful FPGA that offers a range of features and capabilities, making it suitable for a wide range of applications.

FAQ

What voltage specification is listed for XCVU7P-1FLVA2104E?
The listed voltage-related specification for XCVU7P-1FLVA2104E is 0.825V ~ 0.876V.
What is XCVU7P-1FLVA2104E?
Does XCVU7P-1FLVA2104E have quantity-based pricing?
What is the standard lead time for XCVU7P-1FLVA2104E?
What package or case is XCVU7P-1FLVA2104E available in?
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