AMD_XCZU7EV-2FFVC1156E
original

AMD
XCZU7EV-2FFVC1156E

777-XCZU7EV-2FFVC1156E
IC SOC CORTEX-A53 1156FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
533MHz, 600MHz, 1.3GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
360
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XCZU7EV-2FFVC1156E Description

XCZU7EV-2FFVC1156E Description

The XCZU7EV-2FFVC1156E is a high-performance System on Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EV series, combining a multicore ARM® Cortex®-A53 processing system with an UltraScale+™ FPGA fabric. This device integrates 504K+ logic cells, 256KB RAM, and operates at speeds up to 1.3GHz, delivering exceptional processing power for compute-intensive applications. It supports a wide operating temperature range (0°C to 100°C TJ) and features 360 I/O pins, making it suitable for rugged and high-performance environments. Packaged in a 1156-FCBGA tray, it is ROHS3 compliant and adheres to REACH standards.

XCZU7EV-2FFVC1156E Features

  • Heterogeneous Architecture: Combines MCU (ARM Cortex-A53) and FPGA (UltraScale+™) for flexible, high-speed processing.
  • High-Speed Connectivity: Includes CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, and MMC/SD/SDIO interfaces.
  • Robust Peripherals: Integrated DMA and watchdog timer (WDT) for reliable operation.
  • Scalable Performance: Configurable clock speeds (533MHz, 600MHz, 1.3GHz) to balance power and performance.
  • Industrial Durability: MSL 4 (72 hours) rated with a wide thermal range for harsh environments.
  • High I/O Density: 360 programmable I/Os enable versatile interfacing with sensors, memory, and peripherals.

XCZU7EV-2FFVC1156E Applications

  • Embedded Vision: Ideal for AI-powered cameras, ADAS, and machine vision due to FPGA acceleration and ARM processing.
  • Industrial Automation: Supports real-time control, PLCs, and robotics with deterministic FPGA logic and low-latency I/O.
  • Communications Infrastructure: Used in 5G basebands, packet processing, and network acceleration leveraging high-speed interfaces.
  • Aerospace & Defense: Suitable for radar, EW systems, and secure processing with its ruggedized design and ECCN compliance.
  • Medical Imaging: Enables ultrasound and MRI processing with parallel FPGA compute and high-throughput data paths.

Conclusion of XCZU7EV-2FFVC1156E

The XCZU7EV-2FFVC1156E stands out as a versatile, high-performance SoC for applications demanding real-time processing, reconfigurable logic, and robust connectivity. Its UltraScale+™ FPGA + Cortex-A53 integration offers unparalleled flexibility, making it superior to fixed-architecture alternatives. Whether in industrial, automotive, or communications systems, this device delivers scalability, power efficiency, and reliability, cementing AMD's leadership in adaptive computing solutions.

FAQ

What operating temperature range does XCZU7EV-2FFVC1156E support?
XCZU7EV-2FFVC1156E has an operating temperature range of 0°C ~ 100°C (TJ).
What package or case is XCZU7EV-2FFVC1156E available in?
What is the mounting type of XCZU7EV-2FFVC1156E?
Are there related or alternative parts for XCZU7EV-2FFVC1156E?
What voltage specification is listed for XCZU7EV-2FFVC1156E?
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