GigaDevice_GD25LE16E3IGR
GigaDevice_GD25LE16E3IGR
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GigaDevice
GD25LE16E3IGR

774-GD25LE16E3IGR
PDF Datasheet
IC FLASH 16MBIT SPI/QUAD 8WLCSP
12 Weeks

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ISO9001
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Tech Specifications

Clock Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O, QPI
Memory Organization
2M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-WLCSP
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GD25LE16E3IGR Description

GD25LE16E3IGR Description

The GD25LE16E3IGR is a high-performance, 16Mbit SPI/QUAD Flash memory IC designed by GigaDevice Semiconductor (HK) Limited. This memory chip is part of the GD25LE series and is optimized for a wide range of applications requiring reliable and efficient data storage solutions. With a memory organization of 2M x 8, the GD25LE16E3IGR offers a robust storage capacity in a compact 8WLCSP package, making it ideal for space-constrained designs. The device operates within a supply voltage range of 1.65V to 2V, ensuring compatibility with low-power systems.

GD25LE16E3IGR Features

  • High-Speed Operation: The GD25LE16E3IGR supports a clock frequency of up to 133 MHz, enabling rapid data transfer and efficient system performance.
  • Fast Access Time: With an access time of just 6 ns, this Flash memory IC ensures quick data retrieval, crucial for time-sensitive applications.
  • Efficient Write Cycle: The write cycle time for word and page operations is 60µs and 2.4ms, respectively, providing a balance between speed and reliability.
  • Surface Mount Technology: The surface mount mounting type allows for easy integration into modern PCB designs, enhancing both reliability and scalability.
  • SPI/QUAD Interface: The GD25LE16E3IGR supports both SPI and QUAD interfaces, offering flexibility in system design and compatibility with various microcontrollers and processors.
  • Wide Voltage Range: The supply voltage range of 1.65V to 2V ensures compatibility with a variety of low-power systems, making it suitable for battery-operated devices and IoT applications.
  • Tape & Reel Packaging: The GD25LE16E3IGR is available in tape & reel packaging, facilitating automated assembly processes and ensuring consistent quality.

GD25LE16E3IGR Applications

The GD25LE16E3IGR is well-suited for a variety of applications where high-speed, reliable data storage is essential. Some specific use cases include:

  • IoT Devices: The low-power operation and compact size make it ideal for Internet of Things (IoT) devices that require efficient data storage and minimal power consumption.
  • Consumer Electronics: In devices such as smartphones, tablets, and smart home appliances, the GD25LE16E3IGR provides fast and reliable storage for firmware and user data.
  • Industrial Automation: For industrial control systems and automation equipment, the robust performance and wide operating voltage range ensure reliable operation in demanding environments.
  • Automotive Electronics: The GD25LE16E3IGR can be used in automotive systems for storing critical data and firmware, ensuring fast access and reliable performance.
  • Medical Devices: In medical equipment, the high-speed and low-power characteristics of the GD25LE16E3IGR contribute to efficient data logging and system operation.

Conclusion of GD25LE16E3IGR

The GD25LE16E3IGR stands out in the memory IC market due to its combination of high-speed operation, fast access times, and efficient write cycles. Its compact 8WLCSP package and surface mount technology make it easy to integrate into modern electronic designs, while the wide voltage range ensures compatibility with low-power systems. The support for both SPI and QUAD interfaces adds to its versatility, making it suitable for a wide range of applications from IoT devices to industrial automation. With its active product status and reliable performance, the GD25LE16E3IGR is an excellent choice for designers seeking a high-performance Flash memory solution.

FAQ

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