GigaDevice_GD25LE64E3IGR
GigaDevice_GD25LE64E3IGR
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GigaDevice
GD25LE64E3IGR

774-GD25LE64E3IGR
PDF Datasheet
IC FLASH 64MBIT SPI/QUAD 8WLCSP
12 Weeks

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Tech Specifications

Clock Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O, QPI
Memory Organization
8M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-WLCSP
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GD25LE64E3IGR Description

GD25LE64E3IGR Description

The GD25LE64E3IGR is a high-performance, 64Mbit SPI/QUAD Flash memory IC designed by GigaDevice Semiconductor (HK) Limited. This device is part of the GD25LE series and offers a robust solution for various applications requiring reliable and efficient memory storage. The GD25LE64E3IGR features an 8M x 8 memory organization, providing a total memory size of 64Mbit. It operates at a clock frequency of 133 MHz, ensuring fast data access and transfer rates. The memory is organized in a way that supports both word and page write cycles, with respective times of 60µs and 2.4ms, making it suitable for applications that require frequent data updates.

GD25LE64E3IGR Features

  • High-Speed Operation: With a clock frequency of 133 MHz, the GD25LE64E3IGR ensures rapid data processing and transfer, making it ideal for high-speed applications.
  • Fast Access Time: The access time of 6 ns allows for quick retrieval of data, enhancing overall system performance.
  • Flexible Write Cycle Times: The device supports word and page write cycles of 60µs and 2.4ms, respectively, providing flexibility in data writing operations.
  • Wide Voltage Range: The GD25LE64E3IGR operates within a supply voltage range of 1.65V to 2V, making it compatible with a variety of power supply configurations.
  • Surface Mount Packaging: The surface mount mounting type ensures ease of integration into modern PCB designs, reducing the overall footprint and enhancing reliability.
  • SPI/QUAD Interface: The SPI/QUAD interface provides a versatile communication protocol, enabling efficient data transfer and compatibility with various microcontrollers and processors.
  • Tape & Reel Packaging: The GD25LE64E3IGR is available in tape and reel (TR) packaging, facilitating automated assembly processes and ensuring consistent quality.

GD25LE64E3IGR Applications

The GD25LE64E3IGR is well-suited for a wide range of applications due to its high performance and flexibility. Some specific use cases include:

  • Consumer Electronics: Ideal for devices such as smartphones, tablets, and digital cameras, where fast data access and storage are crucial.
  • Telecommunications: Suitable for use in base stations, routers, and other telecom equipment that require reliable and high-speed memory solutions.
  • Automotive Systems: The robustness and performance of the GD25LE64E3IGR make it a suitable choice for automotive infotainment systems and advanced driver assistance systems (ADAS).
  • Industrial Control: The device can be used in industrial automation systems, PLCs, and other control applications that demand efficient memory management.
  • Internet of Things (IoT): The GD25LE64E3IGR is ideal for IoT devices, providing the necessary memory for firmware storage and data logging.

Conclusion of GD25LE64E3IGR

The GD25LE64E3IGR is a versatile and high-performance Flash memory IC that stands out due to its fast access times, flexible write cycles, and wide operating voltage range. Its SPI/QUAD interface and surface mount packaging make it easy to integrate into a variety of systems. The GD25LE64E3IGR is an excellent choice for applications in consumer electronics, telecommunications, automotive systems, industrial control, and IoT, where reliability, speed, and efficiency are paramount.

FAQ

What package or case is GD25LE64E3IGR available in?
GD25LE64E3IGR is available in the 8-XFBGA, WLCSP package / case.
What operating temperature range does GD25LE64E3IGR support?
Is GD25LE64E3IGR currently in stock?
What is the standard lead time for GD25LE64E3IGR?
What is the mounting type of GD25LE64E3IGR?
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