GigaDevice_GD25LE32ENIGR
original

GigaDevice
GD25LE32ENIGR

774-GD25LE32ENIGR
PDF Datasheet
IC FLASH 32MBIT SPI/QUAD 8USON
8 Weeks

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Tech Specifications

Clock Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O, QPI
Memory Organization
4M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-USON (3x4)
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GD25LE32ENIGR Description

GD25LE32ENIGR Description

The GD25LE32ENIGR is a high-performance 32Mbit Flash memory IC chip, part of the GD25LE series manufactured by GigaDevice Semiconductor (HK) Limited. This device is designed for surface mount applications and is available in a Tape & Reel (TR) package, making it suitable for automated assembly processes. The memory is organized as 4M x 8, providing a robust and efficient storage solution for various electronic systems.

GD25LE32ENIGR Features

  • Clock Frequency: The GD25LE32ENIGR operates at a clock frequency of 133 MHz, ensuring fast data transfer rates and high performance in demanding applications.
  • Memory Organization: With a 4M x 8 memory organization, this device offers a total memory size of 32Mbit, providing ample storage for firmware, data, and other critical information.
  • Access Time: The access time of 6 ns allows for rapid data retrieval, enhancing the overall system responsiveness.
  • Write Cycle Time: The write cycle time is optimized for both word and page operations, with word write cycle time at 60µs and page write cycle time at 2.4ms, ensuring efficient data writing processes.
  • Voltage Supply: The device operates within a voltage range of 1.65V to 2V, making it suitable for low-power applications and ensuring compatibility with a wide range of power supplies.
  • Mounting Type: Surface mount technology (SMT) allows for compact and reliable integration into modern electronic devices.
  • Package: The Tape & Reel (TR) packaging format is ideal for mass production and automated assembly lines, reducing manufacturing costs and improving efficiency.
  • Memory Format: The FLASH memory format provides non-volatile storage, ensuring data retention even when power is lost.

GD25LE32ENIGR Applications

The GD25LE32ENIGR is well-suited for a variety of applications due to its high performance and reliability. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring fast access to firmware and data, such as IoT devices, smart meters, and industrial controllers.
  • Consumer Electronics: Suitable for consumer electronics where compact size and high performance are critical, such as smartphones, tablets, and digital cameras.
  • Automotive Electronics: The robustness and reliability of the GD25LE32ENIGR make it suitable for automotive applications, including infotainment systems and advanced driver-assistance systems (ADAS).
  • Medical Devices: The device's low power consumption and high performance make it suitable for medical devices that require reliable data storage and quick access to critical information.

Conclusion of GD25LE32ENIGR

The GD25LE32ENIGR is a versatile and high-performance Flash memory IC chip that offers significant advantages over similar models. Its fast access time, optimized write cycle times, and low power consumption make it an ideal choice for a wide range of applications. The surface mount technology and Tape & Reel packaging further enhance its suitability for modern manufacturing processes. Whether used in embedded systems, consumer electronics, automotive applications, or medical devices, the GD25LE32ENIGR provides reliable and efficient storage solutions, ensuring that data is always accessible and secure.

FAQ

Does GD25LE32ENIGR have quantity-based pricing?
Yes. GD25LE32ENIGR currently has 1 pricing tier(s), starting from 6000 units.
What is the standard lead time for GD25LE32ENIGR?
Is GD25LE32ENIGR currently in stock?
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