Infineon Technologies_BGAP2D30AE6327XTSA1
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Infineon Technologies
BGAP2D30AE6327XTSA1

860-BGAP2D30AE6327XTSA1
PDF Datasheet
WIRELESS INFRASTRUCTURE
97 Weeks

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Tech Specifications

Number of Channels per Chip
1
Power Supply Type
Single
PCB changed
16
HTS
EA
Typical Gain Flatness (dB)
0.23(Max)
Typical Power Gain (dB)
35.2@4200MHz
ECCN (US)
5A991.g
Typical Output Power (dBm)
28.5@4200MHz
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BGAP2D30AE6327XTSA1 Description

With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGAP2D30AE6327XTSA1 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGAP2D30AE6327XTSA1 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGAP2D30AE6327XTSA1 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What is the standard lead time for BGAP2D30AE6327XTSA1?
The standard lead time for BGAP2D30AE6327XTSA1 is 97 Weeks.
What operating temperature range does BGAP2D30AE6327XTSA1 support?
What is BGAP2D30AE6327XTSA1?
Is BGAP2D30AE6327XTSA1 currently in stock?
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