Intel_AGFD023R31C2E4X
Intel_AGFD023R31C2E4X
original

Intel
AGFD023R31C2E4X

777-AGFD023R31C2E4X
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD023R31C2E4X Description

AGFD023R31C2E4X Description

The AGFD023R31C2E4X is a high-performance Embedded IC Chip from Intel, belonging to the Agilex F series. This IC FPGA is designed to deliver exceptional performance and flexibility, making it suitable for a wide range of embedded applications. With a clock speed of 1.4GHz, it ensures rapid processing capabilities. The operating temperature range of 0°C to 100°C (TJ) makes it robust for various environmental conditions. The architecture combines a MPU and FPGA, providing a versatile platform for complex computing tasks. It features 256KB of RAM and 480 I/Os, offering ample memory and connectivity options. The inclusion of peripherals such as DMA and WDT enhances its functionality. The product is currently active and available in a 3184FBGA package, shipped in trays for convenient handling and storage.

AGFD023R31C2E4X Features

  • High-Speed Processing: The AGFD023R31C2E4X operates at a speed of 1.4GHz, ensuring efficient and rapid processing of complex tasks.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), it is suitable for applications in diverse environments.
  • Versatile Architecture: Combining MPU and FPGA, this chip offers a flexible architecture that can handle both general-purpose processing and specialized FPGA tasks.
  • Ample Memory and I/O: Equipped with 256KB of RAM and 480 I/Os, it provides sufficient memory and connectivity options for demanding applications.
  • Enhanced Functionality: Peripherals such as DMA and WDT enhance the chip's functionality, making it suitable for a wide range of applications.
  • Active Product Status: The AGFD023R31C2E4X is currently active, ensuring availability and support for ongoing projects.
  • Robust Connectivity: It supports a variety of connectivity options including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable.
  • Convenient Packaging: Available in a 3184FBGA package and shipped in trays, it ensures easy handling and integration into various systems.

AGFD023R31C2E4X Applications

The AGFD023R31C2E4X is ideal for applications requiring high-speed processing, robust connectivity, and versatile architecture. Some specific use cases include:

  • Industrial Automation: Its high-speed processing and wide temperature range make it suitable for industrial control systems and automation equipment.
  • Telecommunications: The robust connectivity options, including Ethernet and USB OTG, make it ideal for telecom infrastructure and networking devices.
  • Automotive Systems: The combination of MPU and FPGA architecture allows it to handle both general-purpose processing and specialized tasks, making it suitable for advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Medical Devices: The ample memory and I/O options, along with its wide operating temperature range, make it suitable for medical imaging and diagnostic equipment.
  • Consumer Electronics: The versatile architecture and connectivity options make it ideal for smart home devices, wearable technology, and other consumer electronics.

Conclusion of AGFD023R31C2E4X

The AGFD023R31C2E4X from Intel is a powerful and versatile Embedded IC Chip designed to meet the demands of modern embedded applications. Its high-speed processing capabilities, wide operating temperature range, and flexible architecture make it a standout choice in the market. The inclusion of advanced peripherals and robust connectivity options further enhance its functionality, making it suitable for a wide range of applications. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGFD023R31C2E4X offers a reliable and high-performance solution.

FAQ

What package or case is AGFD023R31C2E4X available in?
AGFD023R31C2E4X is available in the 3184-BFBGA Exposed Pad package / case.
Is AGFD023R31C2E4X currently in stock?
Are there related or alternative parts for AGFD023R31C2E4X?
What is the standard lead time for AGFD023R31C2E4X?
What is AGFD023R31C2E4X?
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