Intel_EP2C70F896C8N
original

Intel
EP2C70F896C8N

696-EP2C70F896C8N
PDF Datasheet
Field Programmable Gate Array, 4276 CLBs, 402.5MHz, 68416-Cell, CMOS, PBGA896, LEAD FREE, FBGA-896
26 Weeks

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Tech Specifications

Package/Case
FBGA
Frequency
402.58MHz
Lead Free
Lead Free
Max Frequency
260MHz
Max Operating Temperature
85°C
Max Supply Voltage
1.25V
Memory Size
1152000b
Min Operating Temperature
0°C
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EP2C70F896C8N Description

EP2C70F896C8N Description

The EP2C70F896C8N is a high-performance Field Programmable Gate Array (FPGA) from Intel, designed for demanding embedded applications. This device belongs to the Cyclone® II series, known for its balance of performance, power efficiency, and cost-effectiveness. The EP2C70F896C8N features a total of 622 I/O pins, making it highly versatile for complex system integration. It operates within a temperature range of 0°C to 85°C (TJ), ensuring reliability in various environmental conditions. The device is packaged in an 896-pin Fine Ball Grid Array (FBGA) format, which is ideal for surface mount applications and offers a compact footprint for dense PCB designs.

EP2C70F896C8N Features

  • High Logic Capacity: The EP2C70F896C8N boasts 68,416 logic elements and 4,276 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), providing ample resources for complex digital designs.
  • Substantial RAM: With 1,152,000 total RAM bits, this FPGA can efficiently handle large data sets and complex algorithms, enhancing its suitability for applications requiring significant memory.
  • Power Efficiency: Operating within a supply voltage range of 1.15V to 1.25V, the EP2C70F896C8N is optimized for low power consumption, making it ideal for energy-sensitive applications.
  • Robust I/O Capability: The device supports 622 I/Os, which can be configured for various signaling standards, providing extensive connectivity options.
  • Compliance and Reliability: The EP2C70F896C8N is RoHS compliant and REACH unaffected, ensuring it meets stringent environmental and regulatory standards. It also has a Moisture Sensitivity Level (MSL) of 3 (168 hours), making it suitable for standard manufacturing processes.
  • Packaging and Mounting: The 896FBGA package is designed for surface mount technology, facilitating integration into modern, high-density PCB designs.

EP2C70F896C8N Applications

The EP2C70F896C8N is well-suited for a wide range of embedded applications due to its high logic capacity, substantial RAM, and robust I/O capabilities. Key applications include:

  • Telecommunications: Ideal for base stations, switches, and other telecom infrastructure where high data throughput and processing power are required.
  • Military and Aerospace: Suitable for radar systems, avionics, and other applications that demand high reliability and performance.
  • Industrial Automation: Can be used in programmable logic controllers (PLCs), industrial networks, and robotics for real-time control and data processing.
  • Consumer Electronics: Applicable in high-definition video processing, gaming consoles, and other consumer devices that require complex digital signal processing.
  • Medical Equipment: Useful in imaging devices, diagnostic equipment, and other medical applications where precision and reliability are paramount.

Conclusion of EP2C70F896C8N

The EP2C70F896C8N FPGA from Intel is a versatile and powerful solution for a variety of embedded applications. Its high logic capacity, substantial RAM, and extensive I/O capabilities make it suitable for complex digital designs. The device's power efficiency and compliance with environmental standards further enhance its appeal. Whether used in telecommunications, military, industrial automation, consumer electronics, or medical equipment, the EP2C70F896C8N delivers reliable performance and robust functionality, making it a standout choice in the Cyclone® II series.

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