Lattice Semiconductor_LCMXO2-2000UHC-4FG484C

Lattice Semiconductor
LCMXO2-2000UHC-4FG484C  
FPGAs

LCMXO2-2000UHC-4FG484C
696-LCMXO2-2000UHC-4FG484C
Ersa
Lattice Semiconductor-LCMXO2-2000UHC-4FG484C-datasheets-8953333.pdf
IC FPGA 278 I/O 484FBGA
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LCMXO2-2000UHC-4FG484C Description

The Lattice Semiconductor's LCMXO2-2000UHC-4FG484C is a high-performance field programmable gate array (FPGA) device that is designed to meet the demands of various applications in the electronics industry.

Description:

The LCMXO2-2000UHC-4FG484C is an ultra-high performance, low power FPGA that is based on the company's 28 nm technology. It features a high-density architecture that provides a large number of programmable logic elements, digital signal processing blocks, and memory resources. The device is available in a 484-ball fine pitch ball grid array (FBGA) package, making it suitable for use in a wide range of applications.

Features:

Some of the key features of the LCMXO2-2000UHC-4FG484C include:

  • High-performance programmable logic with low power consumption
  • A wide range of I/O options for flexible system integration
  • Advanced digital signal processing capabilities for demanding applications
  • High-density memory resources for data storage and processing
  • Security features for protecting intellectual property and system integrity
  • A comprehensive development toolset for easy design and implementation

Applications:

The LCMXO2-2000UHC-4FG484C is suitable for a wide range of applications, including:

  • Communications infrastructure, such as routers, switches, and network interface cards
  • Industrial control systems, such as motor control and machine vision
  • Automotive systems, such as advanced driver assistance systems (ADAS) and infotainment systems
  • Consumer electronics, such as set-top boxes, gaming consoles, and smart home devices
  • Aerospace and defense systems, such as radar and electronic warfare systems

Overall, the LCMXO2-2000UHC-4FG484C is a versatile and powerful FPGA that offers high performance, low power consumption, and a wide range of features that make it suitable for a variety of applications in the electronics industry.

Tech Specifications

Program Memory Type
Logic Elements
PPAP
Product Status
Automotive
Total Number of Block RAM
Supplier Package
Device Logic Units
Number of I/O Banks
Package / Case
Voltage - Supply
REACH Status
Family Name
Maximum Operating Supply Voltage (V)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Supplier Temperature Grade
Mounting Type
In-System Programmability
Standard Package Name
Pin Count
Reprogrammability Support
Mounting
Lead Shape
HTSUS
Package
Speed Grade
User I/Os
Maximum Distributed RAM Bits
PCB changed
HTS
ECCN (US)
Supplier Device Package
Operating Supply Voltage (V)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Process Technology
Package Height
Mfr
Number of Logic Elements/Cells
I/O Voltage (V)
RoHS Status
Device Number of DLLs/PLLs
Maximum Differential I/O Pairs
Number of I/O
Embedded Memory (Kbit)
Package Length
Series
Part Status
Package Width
Base Product Number
Shift Registers
Minimum Operating Supply Voltage (V)
Unit Weight
Number of Logic Array Blocks - LABs
Total Memory
Distributed RAM
RoHS
Supply Voltage - Min
Tradename
Operating Supply Current
Maximum Operating Temperature
Supply Voltage - Max
Number of Transceivers
Mounting Style
Number of Logic Elements
Embedded Memory
Adaptive Logic Modules - ALMs
Minimum Operating Temperature
Embedded Block RAM - EBR
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
USHTS

LCMXO2-2000UHC-4FG484C Documents

Download datasheets and manufacturer documentation for LCMXO2-2000UHC-4FG484C

Ersa Alternate Qualified Test Site 30/Sep/2013      
Ersa MachXO2 Family Datasheet       MachXO2 Family Handbook       Package Diagrams      
Ersa All Dev Pkg Mark Chg 12/Nov/2018      
Ersa I2C Read-Back Failure Feb/2015      
Ersa MachXO2 Family Handbook       MachXO2™ Family Datasheet      
Ersa Multiple Devices Cu Wire 01/Jul/2013       Top Mark Format Change 20/Dec/2023      

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