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Micron Technology

MT25QL01GBBB8ESF-0SIT

Name: MT25QL01GBBB8ESF-0SIT
Brand: Micron Technology
SKU: 774-MT25QL01GBBB8ESF-0SIT
Price: 25.10537 USD
Availability: InStock

Manufacturer:

Micron Technology

ERSA Part #:

774-MT25QL01GBBB8ESF-0SIT

Datasheet:

PDF Datasheet

Description:

IC FLASH 1GBIT SPI 133MHZ 16SO

Standard Lead Time:

20 weeks

RoHS Status:

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Tech Specifications

Clock Frequency

133 MHz

Unit Weight

0.258417 oz

Program Current (mA)

Part Status Code

Contact Sales

Component Density

1Gb

Number of Components

PPAP

Operating Current (mA)

MT25QL01GBBB8ESF-0SIT Description

Micron Technology | 3V Serial NOR Flash

MT25QL01GBBB8ESF-0SIT

1Gb (128MB) 3V Quad SPI NOR Flash | 133MHz | Execute-in-Place (XIP) | Industrial Temperature | Stacked Die

✔️ Industrial Temp: -40°C to +85°C ⚡ 133MHz / 90MB/s Quad Read

BRAND

Micron

MT25QL Series

1Gb
Density (128MB)

2.7-3.6V
Supply Range

133MHz
Clock Frequency

90MB/s
Quad Throughput

SOIC-16
300mil Package

Product Overview

The Micron MT25QL01GBBB8ESF-0SIT is a 1Gb (1,073,741,824 bits) high-performance serial NOR Flash memory from the MT25Q family. It is a stacked device consisting of two 512Mb dies in a single package[reference:0][reference:1]. Operating from a standard 2.7V to 3.6V power supply[reference:2][reference:3], it supports standard SPI, Dual SPI, and Quad SPI modes, with a maximum clock frequency of 133 MHz in Single Transfer Rate (STR) mode and 90 MHz in Double Transfer Rate (DTR) mode[reference:4][reference:5], delivering a read throughput of up to 90 MB/s[reference:6][reference:7]. This makes it ideal for execute‑in‑place (XIP), fast booting, and code storage in industrial, networking, and embedded systems.

The device is organized as 128M x 8 (1Gb)[reference:8][reference:9], with a flexible erase architecture: 64KB sectors and 4KB/32KB subsectors[reference:10][reference:11]. Housed in a standard 16‑pin SOP2 (300mil) package (SOIC-16 wide body)[reference:12][reference:13], it operates over the industrial temperature range of -40°C to +85°C[reference:14][reference:15]. With 100,000 program/erase cycles and 20‑year data retention[reference:16][reference:17], the MT25QL01GBBB delivers the endurance and reliability required for industrial control, communications, medical devices, and automotive aftermarket applications.

📊 Technical Specifications

Density / Organization	1Gb (128M x 8) — 128MB[reference:18][reference:19]
Device Architecture	Stacked device (two 512Mb dies)[reference:20][reference:21]
Memory Interface	SPI / Dual SPI / Quad SPI[reference:22][reference:23]
Max Clock Frequency	133 MHz (STR) / 90 MHz (DTR)[reference:24][reference:25]
Quad Read Throughput	Up to 90 MB/s[reference:26][reference:27]
Page Program Size	256 bytes per page
Write Cycle Time (Page)	2.8ms (typical)[reference:28][reference:29]
Erase Granularity	64KB sector, 32KB subsector, 4KB subsector[reference:30][reference:31]
Supply Voltage (Vcc)	2.7V – 3.6V[reference:32][reference:33]
Operating Temperature	Industrial: -40°C to +85°C[reference:34][reference:35]
Storage Temperature	-65°C to +150°C
Package Type	16‑pin SOP2 (300mil, SOIC-16 wide)[reference:36][reference:37]
Package Dimensions	10.3 x 10.3 x 2.65 mm
Endurance	100,000 program/erase cycles[reference:38][reference:39]
Data Retention	20 years @ 55°C[reference:40][reference:41]
Erase Performance (64KB)	400 KB/s[reference:42][reference:43]
Program Performance	2 MB/s[reference:44][reference:45]
Write Protection	Hardware WP# pin, software block protection[reference:46][reference:47]
Security Features	64‑byte OTP, unique 64‑bit ID, password protection[reference:48][reference:49]
Address Modes	3‑byte and 4‑byte address modes[reference:50][reference:51]
JEDEC Signature	3‑byte signature (BA21h)[reference:52][reference:53]
RoHS / Halogen Free	Yes — RoHS3 compliant[reference:54]
Moisture Sensitivity Level	MSL 3 (168 hours)[reference:55]
ECCN	3A991B1A[reference:56][reference:57]
Part Status	Active — In production[reference:58]
Manufacturer Standard Package	1,440 pieces per tray[reference:59]

✨ Key Features

✅ High‑Density 1Gb Storage – 128MB capacity for large firmware, FPGA bitstreams, and data logging[reference:60]
✅ High‑Speed Quad SPI – 133MHz clock, up to 90 MB/s throughput for fast XIP and boot[reference:61]
✅ Stacked Die Architecture – Two 512Mb dies in a single package for high density[reference:62]
✅ Single & Double Transfer Rate (STR/DTR) – Flexible speed options for optimal performance[reference:63]
✅ Execute‑in‑Place (XIP) Support – Direct code execution from Flash memory[reference:64]
✅ Flexible Erase Architecture – 64KB sectors, 32KB/4KB subsectors for granular data management[reference:65]
✅ 3‑Byte and 4‑Byte Address Modes – Enables memory access beyond 128Mb[reference:66]
✅ Hardware & Software Write Protection – WP# pin and configurable protected area[reference:67]
✅ 64‑byte OTP Area – Dedicated one‑time programmable memory for secure data storage[reference:68]
✅ Program/Erase Suspend – Allows interruption of operations for latency‑sensitive reads[reference:69]
✅ High Reliability – 100K P/E cycles, 20‑year data retention at 55°C[reference:70]
✅ Industrial Temperature Range – -40°C to +85°C for harsh environments[reference:71]
✅ Standard SOIC-16 Package – 300mil body, easy PCB layout and drop‑in replacement[reference:72]
✅ JEDEC Standard Command Set – Interoperable with most SPI NOR Flash controllers
✅ JESD47H‑Compliant – Industry‑standard reliability qualification[reference:73]
✅ Long‑term Availability – Micron’s commitment to industrial and embedded markets (15+ years)

🎯 Target Applications:

Industrial control systems, networking routers/switches, set‑top boxes, smart home hubs, IoT gateways, medical devices, automotive aftermarket infotainment, FPGA configuration storage, and battery‑powered portable devices.

⚡ Quad SPI Performance & Modes

Standard SPI (1-1-1)

Single I/O: 133 Mbps
Compatible with all SPI hosts

Dual SPI (1-1-2)

2‑bit read: 266 Mbps
Good speed / pin trade‑off

Quad SPI (1-4-4)

4‑bit read: Up to 90 MB/s (720 Mbps)
Optimal XIP performance[reference:74]

The MT25QL01GBBB supports QPI (Quad Peripheral Interface) mode where all commands and addresses are transmitted over 4 I/O lines. It also features Single and Double Transfer Rate (STR/DTR) modes, providing flexibility for high‑speed random access and enabling seamless execute‑in‑place (XIP) without code shadowing to RAM[reference:75].

🏗️ Stacked Die Architecture

The MT25QL01GBBB is a stacked device consisting of two 512Mb dies integrated into a single package[reference:76][reference:77]. This architecture enables high-density storage in a standard footprint while maintaining the performance and reliability characteristics of Micron's NOR Flash technology. The stacked die configuration is fully transparent to the system, with the device appearing as a single 1Gb memory array. This design approach allows for cost-effective high-density solutions without compromising on speed or endurance.

🔧 Key Architecture Features

• Two 512Mb stacked dies[reference:78]

• 128M x 8 organization[reference:79]

• 3‑byte and 4‑byte addressing[reference:80]

• 64KB sector erase[reference:81]

• 4KB/32KB subsector erase[reference:82]

• Execute‑in‑Place (XIP) support[reference:83]

🔒 Security & Write Protection Features

🔑 Unique 64‑bit Device ID
Each MT25QL01GBBB is factory‑programmed with a unique serial number, enabling device authentication, anti‑counterfeiting, and simple inventory tracking.

📦 64‑byte OTP (One‑Time Programmable) Register
A dedicated OTP area outside the main memory for permanent storage of encryption keys, serial numbers, or manufacturing data[reference:84]. The OTP region can be locked permanently to prevent further writes.

🛡️ Flexible Write Protection
Volatile and nonvolatile locking for each 64KB sector[reference:85]. Nonvolatile configuration locking and password protection provide additional security layers[reference:86].

⏸️ Program/Erase Suspend & CRC Protection
During a long erase operation, the host can issue a suspend command, perform a read from another sector, and then resume the erase without data corruption[reference:87]. CRC detection protects against accidental changes to raw data[reference:88].

📦 Ordering Information & Part Number Decoder

Orderable Part Number	Temperature	Package	Description
MT25QL01GBBB8ESF-0SIT	-40°C to +85°C	SOIC-16 (300mil)	Industrial, tray (1,440 pcs/tray)[reference:89]
MT25QL01GBBB8ESF-0SIT TR	-40°C to +85°C	SOIC-16 (300mil)	Tape & Reel[reference:90]
MT25QL01GBBB8E12-0SIT	-40°C to +85°C	TBGA-24 (6x8mm)	Industrial, BGA package[reference:91]
MT25QL01GBBB8E12-0AAT	-40°C to +105°C	TBGA-24 (6x8mm)	Automotive Grade (AEC-Q100)[reference:92]
MT25QL01GBBB1EW9-0SIT	-40°C to +85°C	W-PDFN-8 (8x6mm)	Industrial, compact package[reference:93]

🔍 Part Number Breakdown (MT25QL01GBBB8ESF-0SIT):
• MT25Q – Micron Quad SPI NOR Flash family
• L – 3V (L) vs U for 1.8V
• 01G – 1Gb density[reference:94]
• BBB – Device stacking (B = 2 die stacked), generation, die revision[reference:95]
• 8E – Package: SOIC-16 (300mil)
• SF – Industrial temperature (-40°C to +85°C) and green[reference:96]
• 0SIT – Standard security (0)[reference:97], SIT = industrial temperature, lead‑free[reference:98]

🏆 Micron Technology – Leader in NOR Flash

Micron Technology is a global leader in memory and storage solutions, with over 40 years of innovation. The MT25Q family represents Micron’s high‑performance NOR Flash portfolio, widely used in industrial, automotive, and consumer electronics. Micron’s NOR Flash products are known for excellent endurance, data retention, and long‑term supply continuity.

Top 3 NOR Flash supplier worldwide – trusted by major OEMs
AEC‑Q100 qualified automotive grade options available
ISO 9001, ISO 14001, IATF 16949 certified fabs
Advanced NOR process nodes for high density and low power
Long‑term product commitment – 15‑20 year availability for industrial and automotive
JESD47H‑compliant – Industry‑standard reliability qualification[reference:99]

🌟 Why Choose MT25QL01GBBB8ESF-0SIT?

• Industry‑standard 133MHz Quad read – up to 90 MB/s[reference:100]

• 1Gb density in standard 300mil SOIC package[reference:101]

• Stacked die architecture for high density[reference:102]

• Industrial temperature -40°C to +85°C[reference:103]

• 100K endurance / 20‑year data retention[reference:104]

• Backed by Micron’s quality and long‑term supply

🛠️ Development Tools & Support

📄 Datasheet & App Notes

Full specification, AC/DC characteristics, timing diagrams, and hardware design guidelines[reference:105].

💻 Software Drivers

Example C code for SPI read/write, Quad mode initialization, and protection management (available on Micron GitHub).

🔌 Programmer Support

Compatible with all major programmers: Elnec, Xeltek, DediProg, Segger J‑Link (SPI mode).

Micron provides free samples, evaluation boards, and direct FAE support through authorized distributors. Design‑in assistance, IBIS models, and failure analysis are available for qualified customers.

📄 Certifications & Compliance

RoHS 2011/65/EU (Compliant)[reference:106]
REACH SVHC (Compliant)[reference:107]
Halogen‑free per IEC 61249-2-21
Conflict Minerals (CFSI) report available
ECCN: 3A991B1A[reference:108]
JESD47H‑compliant[reference:109]

📦 Packaging & Logistics

Tray: 1,440 pieces per tray[reference:110]
Tape & Reel: available upon request
Moisture Sensitivity Level: MSL 3 (168 hours)[reference:111]
Lead finish: NiPdAu (green, lead‑free)
Lead time: 8‑10 weeks ARO, stock via distributors[reference:112]

📧 [email protected] | 🌐 www.micron.com/products/nor-flash/mt25q

FAQ

This is a 1-gigabit (1 Gb / 128 MB) serial NOR Flash memory device. It is organized as 128M × 8 bits and uses a high-speed SPI-compatible serial bus interface with Quad I/O support. The device features a stacked architecture consisting of two 512Mb die.