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MT46H8M16LFCF-75
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MT46H8M16LFCF-75 Description
MT46H8M16LFCF‑75
128 Mb Mobile LPDDR SDRAM organized as 8M × 16, operating at 1.8 V with a peak clock frequency of 133 MHz and 6 ns access time. Features a double‑data‑rate (DDR) architecture, four internal banks, and low‑power modes including auto refresh, self refresh, and partial‑array self refresh (PASR). Qualified for industrial temperature range (–40°C to +85°C) – ideal for mobile, automotive, and portable embedded applications.
Note: This part is End‑of‑Life (EOL) / Obsolete.
128 Mb (16 MB)
8M × 16
133 MHz
6 ns
1.8 V ± 0.1 V
1.7 V – 1.9 V
60‑VFBGA (8×10 mm)
16 bit
4 banks
2, 4, 8
4096 cycles
–40 °C to +85 °C (Industrial)
Parallel
Obsolete (EOL)
Technical Highlights
- Mobile DDR Architecture: Internal, pipelined double‑data‑rate (DDR) architecture delivers two data accesses per clock cycle for high bandwidth.
- Low‑Power Features: Auto refresh, self refresh, and partial‑array self refresh (PASR) modes with an on‑chip temperature sensor to control refresh rate.
- Flexible Programmability: Programmable burst lengths (2, 4, or 8), concurrent auto precharge, and selectable output drive (DS) for system optimisation.
- Signal Integrity: Bidirectional data strobe (DQS) per byte, differential clock inputs (CK and CK#), and 1.8 V LVCMOS‑compatible inputs.
- Industrial Temperature Range: –40°C to +85°C operation ensures reliability in harsh environments, including automotive and outdoor applications.
- Green Package: RoHS‑compliant, halogen‑free, and Pb‑free 60‑ball VFBGA (8×10 mm) package.
- Mobile Phones & Handheld Devices
- Automotive Infotainment & Clusters
- Portable Medical Equipment
- Industrial Handheld Terminals
- GPS Navigation Systems
- Low power consumption for battery‑operated devices
- High bandwidth with DDR architecture
- Industrial temperature range for harsh environments
- Compact 8×10 mm VFBGA footprint
- Green package (Pb‑free, halogen‑free)
Selection / Replacement Notes
- Must match: Density (128 Mb), organization (8M × 16), voltage (1.8 V), and interface (Parallel) are critical. Temperature range (–40 to +85°C) must be verified for industrial applications.
- Flexible: Burst lengths (2, 4, 8) and output drive strength are programmable via mode registers; some timing parameters may be adjusted to suit your controller.
- Suffix / package: "IT" denotes industrial temperature (–40 to +85°C); "TR" indicates tape‑and‑reel packaging. Package is 60‑VFBGA (8×10 mm) – ensure ball‑out compatibility with your PCB.
- Compatibility: This is a Mobile LPDDR SDRAM; verify that your memory controller supports 1.8 V I/O and LPDDR timing. This part is Obsolete (EOL); for new designs, consider LPDDR2 or LPDDR3 alternatives.
Alternative Models
| Model | Key Difference |
|---|---|
| MT46H8M16LFCF-75 IT | Industrial temperature (–40 to +85°C) – extended range |
| MT46H8M16LFCF-75 TR | Tape & Reel packaging variant |
| MT46H8M16LFCF-10 | 100 MHz speed – slower performance |
| MT46H16M16LFCF-75 | Double density (256 Mb) – higher capacity |
Always verify pinout, voltage, and timing with the official manufacturer datasheet before substitution.
All data based on typical conditions. For latest information, consult the official Micron datasheet.



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