MT46H8M16LFCF-75
Micron Technology_MT46H8M16LFCF-75
original

Micron Technology
MT46H8M16LFCF-75

774-MT46H8M16LFCF-75
PDF Datasheet
IC DRAM 128MBIT PAR 60VFBGA

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Tech Specifications

Mfr
Micron Technology Inc.
Series
-
Packaging
Tray
Part Status
Obsolete
Memory Type
Volatile
Memory Format
DRAM
Technology
SDRAM - Mobile LPDDR
Memory Size
128Mbit
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MT46H8M16LFCF-75 Description

Micron Technology ● Mobile LPDDR SDRAM ✓ Obsolete • Industrial Temp
■
LPDDR · 128 Mb
60‑VFBGA (8×10 mm)
RoHS Halogen‑Free JEDEC EOL
Mobile Low‑Power DDR SDRAM

MT46H8M16LFCF‑75

★ Industrial / Commercial • 8M × 16 • 133 MHz • –40°C to +85°C

128 Mb Mobile LPDDR SDRAM organized as 8M × 16, operating at 1.8 V with a peak clock frequency of 133 MHz and 6 ns access time. Features a double‑data‑rate (DDR) architecture, four internal banks, and low‑power modes including auto refresh, self refresh, and partial‑array self refresh (PASR). Qualified for industrial temperature range (–40°C to +85°C) – ideal for mobile, automotive, and portable embedded applications.
Note: This part is End‑of‑Life (EOL) / Obsolete.

Memory Density
128 Mb (16 MB)
Organization
8M × 16
Max Clock Frequency
133 MHz
Access Time
6 ns
Voltage (VDD / VDDQ)
1.8 V ± 0.1 V
Supply Voltage Range
1.7 V – 1.9 V
Package
60‑VFBGA (8×10 mm)
Data Bus Width
16 bit
Internal Banks
4 banks
Burst Lengths
2, 4, 8
Refresh Count
4096 cycles
Operating Temperature
–40 °C to +85 °C (Industrial)
Interface
Parallel
Product Status
Obsolete (EOL)

Technical Highlights

  • Mobile DDR Architecture: Internal, pipelined double‑data‑rate (DDR) architecture delivers two data accesses per clock cycle for high bandwidth.
  • Low‑Power Features: Auto refresh, self refresh, and partial‑array self refresh (PASR) modes with an on‑chip temperature sensor to control refresh rate.
  • Flexible Programmability: Programmable burst lengths (2, 4, or 8), concurrent auto precharge, and selectable output drive (DS) for system optimisation.
  • Signal Integrity: Bidirectional data strobe (DQS) per byte, differential clock inputs (CK and CK#), and 1.8 V LVCMOS‑compatible inputs.
  • Industrial Temperature Range: –40°C to +85°C operation ensures reliability in harsh environments, including automotive and outdoor applications.
  • Green Package: RoHS‑compliant, halogen‑free, and Pb‑free 60‑ball VFBGA (8×10 mm) package.
🚀 Key Applications
  • Mobile Phones & Handheld Devices
  • Automotive Infotainment & Clusters
  • Portable Medical Equipment
  • Industrial Handheld Terminals
  • GPS Navigation Systems
⚡ Key Benefits
  • Low power consumption for battery‑operated devices
  • High bandwidth with DDR architecture
  • Industrial temperature range for harsh environments
  • Compact 8×10 mm VFBGA footprint
  • Green package (Pb‑free, halogen‑free)

Selection / Replacement Notes

  • Must match: Density (128 Mb), organization (8M × 16), voltage (1.8 V), and interface (Parallel) are critical. Temperature range (–40 to +85°C) must be verified for industrial applications.
  • Flexible: Burst lengths (2, 4, 8) and output drive strength are programmable via mode registers; some timing parameters may be adjusted to suit your controller.
  • Suffix / package: "IT" denotes industrial temperature (–40 to +85°C); "TR" indicates tape‑and‑reel packaging. Package is 60‑VFBGA (8×10 mm) – ensure ball‑out compatibility with your PCB.
  • Compatibility: This is a Mobile LPDDR SDRAM; verify that your memory controller supports 1.8 V I/O and LPDDR timing. This part is Obsolete (EOL); for new designs, consider LPDDR2 or LPDDR3 alternatives.

Alternative Models

Model Key Difference
MT46H8M16LFCF-75 IT Industrial temperature (–40 to +85°C) – extended range
MT46H8M16LFCF-75 TR Tape & Reel packaging variant
MT46H8M16LFCF-10 100 MHz speed – slower performance
MT46H16M16LFCF-75 Double density (256 Mb) – higher capacity

Always verify pinout, voltage, and timing with the official manufacturer datasheet before substitution.

■ Packaging: Tray & Tape/Reel ■ MSL: Level 3 (260°C) ■ Moisture Sensitivity: 168 hours
● Obsolete – Limited Stock
✓ 100% Original Micron Silicon ✓ Halogen-free / RoHS 2015/863 ✓ Full traceability & Certificate of Conformance ✓ ECCN: EAR99
© 2026 Micron Technology, Inc. • MT46H8M16LFCF-75 • Preliminary specifications – subject to change without notice.
All data based on typical conditions. For latest information, consult the official Micron datasheet.

FAQ

What type of memory is the MT46H8M16LFCF-75, and what are its key specifications?
The MT46H8M16LFCF-75 is a 128Mb (128 Megabit) Mobile LPDDR SDRAM from Micron Technology. It is a high-speed CMOS, dynamic random-access memory internally configured as a quad-bank DRAM. Its key specifications are: Parameter Detail Memory Type Mobile LPDDR SDRAM Density 128 Mbit (16 MB) Organization 8M x 16 bits (2 Meg x 16 x 4 banks) Data Bus Width 16-bit Package 60-ball VFBGA (8x10 mm) Max Clock Frequency 133 MHz Access Time 6 ns Write Cycle Time 15 ns Supply Voltage 1.7V – 1.9V I/O Voltage 1.8V (1.7V – 1.95V)
What are the operating voltage and temperature range for this device?
What are the typical applications and key features of this device?
What are the packaging options and part status?
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