This electronic part puts Tray method in the first place. Packaging method of this TE28F160C3BD70 aims to use on multiple product types and build brand identity. This TE28F160C3BD70 is produced by this Micron Technology and this manufacturer aims to provide original and genuine products to consumers. The vision of this Micron Technology establishes a strong ability to deliver goods in stock and meet customers' needs for one-stop procurement. This TE28F160C3BD70 is a member of Memory ICs Products category. It falls under the category of Memory IC Chips. Any integrated circuit with the capability to store bits of data in memory cells within a memory array. The main function of memory IC is the storing and retrieval of such electronic data. This TE28F160C3BD70 is mainly applied in memory-based electronic devices such as mobile phones, computers, tablets, medical devices, smart cards, digital cameras, communication equipment, and other digital electronic devices.
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