Microsemi_A2F060M3E-1FGG256I
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Microsemi
A2F060M3E-1FGG256I

777-A2F060M3E-1FGG256I
PDF Datasheet
IC SOC CORTEX-M3 100MHZ 256FBGA

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Tech Specifications

Package/Case
LBGA
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Number of I/Os
10
Number of Logic Blocks (LABs)
8
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A2F060M3E-1FGG256I Description

A2F060M3E-1FGG256I Description

The A2F060M3E-1FGG256I is an advanced embedded IC chip from the SmartFusion® series, manufactured by Microsemi Corporation. This chip is designed to deliver high performance and reliability in various embedded systems. It features a Cortex-M3 processor core, operating at a speed of 100MHz, making it suitable for demanding applications that require fast processing capabilities. The architecture combines a microcontroller (MCU) with a field-programmable gate array (FPGA), providing flexibility and programmability for custom logic and control functions.

A2F060M3E-1FGG256I Features

The A2F060M3E-1FGG256I offers a comprehensive set of features that enhance its functionality and performance:

  • Speed: The Cortex-M3 core operates at 100MHz, ensuring rapid execution of complex tasks.
  • Architecture: The combination of MCU and FPGA allows for both high-level control and low-level custom logic implementation.
  • Memory: It includes 128KB of flash memory and 16KB of RAM, providing ample storage for code and data.
  • Peripherals: The chip is equipped with Direct Memory Access (DMA), Power-On Reset (POR), and Watchdog Timer (WDT) peripherals, enhancing system robustness and efficiency.
  • Connectivity: It supports a variety of interfaces, including External Bus Interface (EBI), External Memory Interface (EMI), I2C, SPI, and UART/USART, facilitating seamless communication with other components.
  • Package: The 256FBGA package ensures a compact and reliable physical form factor.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), it is suitable for a wide range of environmental conditions.
  • ECCN and REACH Status: The chip is classified under ECCN 3A991D and is REACH unaffected, ensuring compliance with international regulations.

A2F060M3E-1FGG256I Applications

The A2F060M3E-1FGG256I is ideal for a variety of applications due to its versatile architecture and robust feature set:

  • Industrial Automation: The combination of MCU and FPGA allows for precise control and real-time processing, making it suitable for programmable logic controllers (PLCs) and industrial robots.
  • Medical Devices: The high reliability and compliance with international standards make it ideal for medical imaging equipment and diagnostic tools.
  • Telecommunications: The chip's high-speed processing and connectivity options make it suitable for base station controllers and network routers.
  • Automotive Systems: The robustness and flexibility of the chip make it ideal for advanced driver-assistance systems (ADAS) and engine control units (ECUs).

Conclusion of A2F060M3E-1FGG256I

The A2F060M3E-1FGG256I from Microsemi Corporation is a powerful and versatile embedded IC chip designed for high-performance applications. Its unique combination of a Cortex-M3 processor and FPGA architecture, along with its extensive feature set, makes it a standout choice for a variety of industries. While the product is now obsolete, its legacy continues to influence the design of modern embedded systems. For those seeking a reliable and high-performance solution, the A2F060M3E-1FGG256I remains a benchmark in the field of embedded IC chips.

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