Microsemi_A2F060M3E-CSG288
Microsemi_A2F060M3E-CSG288
original

Microsemi
A2F060M3E-CSG288

777-A2F060M3E-CSG288
PDF Datasheet
IC SOC CORTEX-M3 80MHZ 288CSP

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Tech Specifications

Package/Case
TFBGA
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Number of I/Os
10
Number of Logic Blocks (LABs)
8
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A2F060M3E-CSG288 Description

A2F060M3E-CSG288 Description

The A2F060M3E-CSG288 is a System on Chip (SoC) from Microsemi Corporation, part of the SmartFusion® series. This SoC is designed to deliver high performance and flexibility for a wide range of embedded applications. It features an 80MHz Cortex-M3 processor, providing robust processing capabilities. The device operates within a temperature range of 0°C to 85°C (TJ), making it suitable for various environmental conditions. The architecture combines a microcontroller (MCU) and Field Programmable Gate Array (FPGA), offering a versatile platform for complex system designs.

The A2F060M3E-CSG288 comes with 128KB of Flash memory and 16KB of RAM, ensuring ample storage for both program code and data. It supports a variety of peripherals, including Direct Memory Access (DMA), Power-On Reset (POR), and Watchdog Timer (WDT), enhancing its functionality and reliability. The SoC also offers extensive connectivity options through External Bus Interface/External Memory Interface (EBI/EMI), I2C, SPI, and UART/USART, facilitating seamless communication with other devices.

Packaged in a 288-pin CSP (Chip Scale Package), the A2F060M3E-CSG288 is designed for high-density applications. It has a Moisture Sensitivity Level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering. The product is classified under ECCN 3A991D and HTSUS 8542.39.0001, and it is REACH unaffected, ensuring compliance with international regulations.

A2F060M3E-CSG288 Features

  • High-Speed Performance: The 80MHz Cortex-M3 processor ensures fast execution of complex tasks, making the A2F060M3E-CSG288 ideal for demanding applications.
  • Flexible Architecture: Combining an MCU and FPGA, this SoC provides a versatile platform that can be customized to meet specific application requirements.
  • Robust Memory: With 128KB of Flash and 16KB of RAM, the device offers sufficient storage for both program code and data, supporting complex applications.
  • Advanced Peripherals: Features like DMA, POR, and WDT enhance the device's functionality and reliability, ensuring stable operation.
  • Extensive Connectivity: The SoC supports EBI/EMI, I2C, SPI, and UART/USART, facilitating seamless communication with other devices.
  • Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 85°C (TJ), making it suitable for various environmental conditions.
  • Compliance and Packaging: The A2F060M3E-CSG288 is REACH unaffected and packaged in a 288-pin CSP, ensuring compliance with international regulations and suitability for high-density applications.

A2F060M3E-CSG288 Applications

The A2F060M3E-CSG288 is ideal for applications requiring high performance, flexibility, and extensive connectivity. Its combination of an MCU and FPGA makes it suitable for complex system designs, such as:

  • Industrial Automation: The SoC's high-speed processing and extensive connectivity options make it ideal for controlling and monitoring industrial processes.
  • Telecommunications: The device's robust performance and reliable operation make it suitable for telecom infrastructure, such as base stations and network equipment.
  • Automotive Systems: The wide operating temperature range and high-density packaging make the A2F060M3E-CSG288 suitable for automotive applications, such as engine control units and advanced driver-assistance systems (ADAS).
  • Medical Devices: The SoC's reliability and compliance with international regulations make it suitable for medical equipment, such as diagnostic devices and patient monitoring systems.

Conclusion of A2F060M3E-CSG288

The A2F060M3E-CSG288 is a versatile and high-performance SoC from Microsemi Corporation, offering a unique combination of an MCU and FPGA architecture. Its robust processing capabilities, extensive connectivity options, and wide operating temperature range make it suitable for a wide range of applications, from industrial automation to automotive systems. While the product is now obsolete, its legacy continues to influence the design of modern SoCs, highlighting the importance of flexibility, performance, and reliability in embedded systems.

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