Microsemi_A2F060M3E-FGG256
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Microsemi
A2F060M3E-FGG256

777-A2F060M3E-FGG256
PDF Datasheet
Field Programmable Gate Array,

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Tech Specifications

Package/Case
LBGA
Core Architecture
ARM
Data Rate
400Kbps
Frequency
100MHz
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Max Supply Voltage
1.575V
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A2F060M3E-FGG256 Description

A2F060M3E-FGG256 Description

The A2F060M3E-FGG256 is a high-performance System on Chip (SoC) from Microsemi Corporation, part of the renowned SmartFusion® series. This SoC integrates a Cortex-M3 processor with an operating speed of 80MHz, making it suitable for demanding applications requiring rapid processing capabilities. The device features a robust architecture combining a Microcontroller Unit (MCU) and a Field-Programmable Gate Array (FPGA), offering flexibility and programmability. It is housed in a 256-pin Fine Ball Grid Array (FBGA) package, ensuring compactness and high-density integration.

A2F060M3E-FGG256 Features

  • High-Speed Performance: The Cortex-M3 core operates at 80MHz, providing efficient processing power for complex tasks.
  • Memory Configuration: Equipped with 128KB of Flash memory and 16KB of RAM, the A2F060M3E-FGG256 offers ample storage for firmware and runtime data.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 85°C (TJ), it is suitable for both standard and rugged environments.
  • Advanced Connectivity Options: The SoC supports a variety of interfaces, including EBI/EMI for external memory interfacing, I2C, SPI, and UART/USART for communication with peripherals.
  • Peripheral Integration: Features Direct Memory Access (DMA), Power-On Reset (POR), and Watchdog Timer (WDT) for enhanced system management and reliability.
  • Compliance and Safety: Classified under ECCN 3A991D and HTSUS 8542.39.0001, it meets international export control regulations. Additionally, it is REACH unaffected, ensuring compliance with environmental and safety standards.
  • Packaging and Handling: The device is packaged in a tray with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), facilitating safe storage and handling in manufacturing environments.

A2F060M3E-FGG256 Applications

The A2F060M3E-FGG256 is ideal for a range of applications where high performance, flexibility, and reliability are paramount. Its integrated MCU and FPGA architecture make it suitable for:

  • Industrial Automation: Managing complex control systems and interfacing with various sensors and actuators.
  • Embedded Systems: Ideal for embedded applications requiring real-time processing and low power consumption.
  • Communication Systems: Utilizing its connectivity options for data transmission and network management.
  • Consumer Electronics: Enhancing performance in devices such as smart appliances and wearable technology.
  • Automotive Electronics: Suitable for automotive applications requiring high reliability and performance.

Conclusion of A2F060M3E-FGG256

The A2F060M3E-FGG256 stands out in the System on Chip (SoC) market due to its high-speed processing capabilities, extensive memory, and versatile connectivity options. Its integrated MCU and FPGA architecture offers a unique blend of flexibility and programmability, making it suitable for a wide range of applications. Despite being marked as obsolete, the A2F060M3E-FGG256 remains a reliable choice for designers seeking a robust SoC solution. Its compliance with international standards and safety regulations ensures that it meets the stringent requirements of the electronics industry.

FAQ

What voltage specification is listed for A2F060M3E-FGG256?
The listed voltage-related specification for A2F060M3E-FGG256 is 1.575V.
What operating temperature range does A2F060M3E-FGG256 support?
What is the mounting type of A2F060M3E-FGG256?
Is A2F060M3E-FGG256 currently in stock?
What package or case is A2F060M3E-FGG256 available in?
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