Microsemi_M2GL100-1FCG1152
original

Microsemi
M2GL100-1FCG1152

696-M2GL100-1FCG1152
PDF Datasheet
IC FPGA 574 I/O 1152FCBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
3637248
ECCN
3A001A7A
Number of I/O
574
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1152-FCBGA (35x35)
Series
IGLOO2
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M2GL100-1FCG1152 Description

Microsemi's M2GL100-1FCG1152 is a high-performance, low-power, and high-density memory device designed for use in various applications. Here is a description of the model, its features, and potential applications:

Description:

The M2GL100-1FCG1152 is a 128Mb (16M x 8) low-power SRAM (Static Random Access Memory) device offered in a compact 1152-ball FCBGA package. It is designed to provide high-speed data storage and retrieval, making it suitable for a wide range of applications that require high performance and low power consumption.

Features:

  1. High Performance: The M2GL100-1FCG1152 offers high-speed data access with a clock frequency of up to 166 MHz, ensuring fast and efficient data processing.
  2. Low Power Consumption: This memory device is designed to consume low power, making it an ideal choice for battery-powered or energy-sensitive applications.
  3. High Density: With a capacity of 128Mb, the M2GL100-1FCG1152 provides high-density storage, allowing for more data to be stored in a smaller form factor.
  4. Robustness: The device is built to withstand a wide range of operating temperatures (-40°C to +85°C) and offers a guaranteed 10-year data retention, ensuring reliable performance in various environments.
  5. Advanced Security Features: The M2GL100-1FCG1152 includes advanced security features such as secure key storage, secure boot, and secure debug, making it suitable for applications that require high levels of data protection.

Applications:

  1. Networking and Communications: The high-speed performance and low power consumption of the M2GL100-1FCG1152 make it ideal for use in networking equipment, routers, and communication systems.
  2. Industrial Automation: The device's robustness and wide temperature range make it suitable for use in industrial automation systems, where reliable performance is crucial.
  3. Medical Equipment: The M2GL100-1FCG1152's high-density storage and advanced security features make it suitable for use in medical imaging systems, patient monitoring devices, and other medical equipment.
  4. Aerospace and Defense: The device's ability to operate in extreme temperatures and its high reliability make it suitable for use in aerospace and defense applications, such as satellite systems and military communication equipment.
  5. Automotive: The M2GL100-1FCG1152 can be used in advanced driver assistance systems (ADAS), infotainment systems, and other automotive applications that require high-speed data processing and low power consumption.

In summary, Microsemi's M2GL100-1FCG1152 is a high-performance, low-power, and high-density SRAM device that offers a range of features, making it suitable for various applications, including networking, industrial automation, medical equipment, aerospace and defense, and automotive systems.

FAQ

What voltage specification is listed for M2GL100-1FCG1152?
The listed voltage-related specification for M2GL100-1FCG1152 is 1.14V ~ 2.625V.
Are there related or alternative parts for M2GL100-1FCG1152?
What is the mounting type of M2GL100-1FCG1152?
What is M2GL100-1FCG1152?
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