NXP Semiconductors_LPC1111FHN33/102,5

NXP Semiconductors
LPC1111FHN33/102,5  
Microcontrollers

NXP Semiconductors
LPC1111FHN33/102,5
685-LPC1111FHN33/102,5
Ersa
NXP Semiconductors-LPC1111FHN33/102,5-datasheets-9583214.pdf
IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111FHN33/102,5 Description

The LPC1111FHN33/102,5 is a low-power, high-performance microcontroller (MCU) from NXP Semiconductors. It is part of the LPC1100 series of MCUs, which are designed for a wide range of embedded applications that require low power consumption, high performance, and a small form factor.

Description:

The LPC1111FHN33/102,5 is a 32-bit ARM Cortex-M0-based MCU with 8KB of on-chip Flash memory and 2KB of on-chip RAM. It features a range of communication interfaces, including I2C, SPI, and UART, as well as a USB interface for high-speed data transfer. The device also includes a range of peripherals, such as a 10-bit ADC, a DAC, and a PWM controller, making it suitable for a wide range of applications.

Features:

  • 32-bit ARM Cortex-M0 processor with a clock speed of up to 50 MHz
  • 8KB on-chip Flash memory and 2KB on-chip RAM
  • USB 2.0 full-speed device interface
  • I2C, SPI, and UART communication interfaces
  • 10-bit ADC with up to 8 channels
  • 10-bit DAC with 2 channels
  • PWM controller with up to 6 channels
  • RTC with alarm and periodic interrupt functions
  • Up to 12 GPIO pins with various functions
  • Low-power sleep modes to conserve energy

Applications:

The LPC1111FHN33/102,5 is suitable for a wide range of embedded applications, including:

  1. Industrial control and automation systems
  2. Medical devices and equipment
  3. Consumer electronics, such as portable devices and smart home appliances
  4. Battery-powered devices, such as wireless sensors and IoT devices
  5. Automotive applications, such as infotainment systems and body control modules
  6. Security systems, including access control and surveillance cameras

In summary, the LPC1111FHN33/102,5 is a versatile and low-power MCU that offers a range of features and communication interfaces, making it suitable for a wide range of embedded applications. Its small form factor and low power consumption make it an ideal choice for applications where space and energy efficiency are critical.

Tech Specifications

Core Processor
Program Memory Type
Product Status
Supplier Device Package
EEPROM Size
Package / Case
REACH Status
Mfr
Voltage - Supply (Vcc/Vdd)
RoHS Status
Moisture Sensitivity Level (MSL)
Speed
Operating Temperature
RAM Size
ECCN
Number of I/O
Peripherals
Mounting Type
Oscillator Type
Series
Core Size
Connectivity
Program Memory Size
HTSUS
Package
Data Converters
Base Product Number
PPAP
Data Bus Width (bit)
SPI
Automotive
Supplier Package
Instruction Set Architecture
Core Architecture
Family Name
Maximum Operating Supply Voltage (V)
Maximum Clock Rate (MHz)
EU RoHS
PWM
Standard Package Name
Pin Count
Mounting
Parallel Master Port
CAN
USART
Ethernet
Typical Operating Supply Voltage (V)
Programmability
PCB changed
HTS
ECCN (US)
Real Time Clock
Maximum Power Dissipation (mW)
Device Core
ADC Channels
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
No. of Timers
Package Height
I2C
Interface Type
Maximum CPU Frequency (MHz)
Number of ADCs
USB
UART
I2S
Package Length
ADC Resolution (bit)
Watchdog
Part Status
Number of I/Os
Package Width
Minimum Operating Supply Voltage (V)

LPC1111FHN33/102,5 Documents

Download datasheets and manufacturer documentation for LPC1111FHN33/102,5

Ersa LPC1110-15      
Ersa All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      
Ersa LPC111x/LPC11Cxx Manual      
Ersa LPC1110-15      
Ersa Packing Label Chg 28/Dec/2016      
Ersa NXP USA Inc REACH       NXP USA Inc RoHS Cert      

Shopping Guide

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