NXP Semiconductors

LPC1112FHI33/202,5  

Microcontrollers

The LPC1112FHI33/202,5 is a low-power, high-performance microcontroller (MCU) from NXP Semiconductors. It belongs to the LPC100 series, which is designed for a wide range of embedded applications that require low power consumption and high processing capabilities.

Description:

The LPC1112FHI33/202,5 is an ARM Cortex-M0-based MCU with a 32-bit memory protection unit (MPU) and a high-speed USB On-The-Go (USB OTG) interface. It is available in a 32-pin package and operates at a core frequency of up to 50 MHz. The device features 16 kB of on-chip RAM and 16 kB of user-accessible EEPROM.

Features:

1. ARM Cortex-M0 processor core with a core frequency of up to 50 MHz.
2. 16 kB on-chip RAM and 16 kB user-accessible EEPROM.
3. Memory protection unit (MPU) for enhanced security.
4. High-speed USB On-The-Go (USB OTG) interface for easy connectivity.
5. 12-channel DMA controller for efficient data transfer.
6. Up to 21 general-purpose input/output (GPIO) pins with various functions.
7. 10-bit ADC with up to 8 channels.
8. Flexible clock management for power optimization.
9. Integrated voltage regulator and power management.
10. Low-power sleep modes for extended battery life.

Applications:

The LPC1112FHI33/202,5 is suitable for a wide range of embedded applications, including but not limited to:

1. Industrial control and automation systems.
2. Medical devices and equipment.
3. Consumer electronics, such as portable devices and wearables.
4. Smart home and IoT devices.
5. Automotive applications, such as infotainment systems and body control modules.
6. Wireless communication devices, including Zigbee, Bluetooth, and Wi-Fi modules.
7. Human Interface Devices (HID), such as keyboards and mice.
8. Data acquisition and signal processing systems.
9. Battery-powered devices, where low power consumption is critical.

The LPC1112FHI33/202,5's combination of low power consumption, high performance, and a rich set of features make it an ideal choice for developers looking to create energy-efficient and high-performance embedded systems.

LPC1112FHI33/202,5 Documents

Download datasheets and manufacturer documentation for LPC1112FHI33/202,5

PCN Assembly/Origin :

Assembly Site 14/Jun/2023      

Datasheets :

LPC1110-15      

PCN Packaging :

All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      

HTML Datasheet :

LPC1110-15      

Environmental Information :

NXP USA Inc REACH       NXP USA Inc RoHS Cert