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RFQ

SAMSUNG

KLM8G1GETF-B041

Name: KLM8G1GETF-B041
Brand: SAMSUNG
SKU: 774-KLM8G1GETF-B041

Manufacturer:

SAMSUNG

ERSA Part #:

774-KLM8G1GETF-B041

Datasheet:

PDF Datasheet

Description:

Flash Card, 8GX8, CARD

RoHS Status:

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Tech Specifications

Max Operating Temperature

Min Operating Temperature

-25

Width

11.5

Length

Number of Functions

Temperature Grade

OTHER

Supply Voltage-Nom (Vsup)

1.8

Number of Words

8589934592

KLM8G1GETF-B041 Description

SAMSUNG | eMMC 5.1

KLM8G1GETF-B041

8GB eMMC 5.1 Flash | High‑Performance Embedded Storage | Industrial Grade

✔️ eMMC 5.1 / HS400 🌡️ -25°C to +85°C

BRAND

SAMSUNG

eMMC 5.1 Series

8GB
Capacity

5.1
eMMC Standard

HS400
Interface Speed

3.3 / 1.8V
Vcc / Vccq

153
Ball FBGA

Product Overview

The Samsung KLM8G1GETF-B041 is a high‑performance 8GB embedded MultiMediaCard (eMMC) 5.1 compliant device. It integrates Samsung’s advanced V‑NAND technology with a dedicated eMMC controller, delivering reliable and efficient storage for embedded systems. The device supports HS400 (High Speed DDR400) interface mode, enabling sequential read speeds up to 320 MB/s and write speeds up to 150 MB/s (typical). It operates over an industrial temperature range of -25°C to +85°C, making it suitable for outdoor and demanding environments.

The built‑in controller handles all NAND management functions including wear leveling, bad block management, ECC (up to 60‑bit), and power‑off protection. This simplifies host software development and improves system reliability. The KLM8G1GETF-B041 is ideal for bootable storage in industrial PCs, networking equipment, medical devices, and portable embedded systems.

📊 Technical Specifications

Capacity	8 GB (user area) + boot partitions (2×4MB) + RPMB (4MB) + GP partitions
eMMC Standard	JEDEC eMMC 5.1 compliant (backward compatible to 4.5/5.0)
Interface	MMC interface (8‑bit parallel, HS400 @ 200 MHz DDR)
Performance (Typical)	Seq. Read: 320 MB/s \| Seq. Write: 150 MB/s \| Random Read (4KB): 12k IOPS
Supply Voltage	Vcc (NAND) = 2.7 – 3.6V, Vccq (I/O) = 1.70 – 1.95V or 2.7 – 3.6V
Operating Temperature	-25°C to +85°C (case temperature)
Storage Temperature	-40°C to +85°C
Package	153‑ball FBGA (11.5×13.0×1.0 mm), 0.5mm pitch, lead‑free
Endurance	3,000 program/erase cycles (typical for industrial use)
Data Retention	10 years @ 55°C
Power (Active/Sleep)	Active: 250 mW typ.; Sleep: 2 mW; Deep sleep: 0.5 mW
Features	Boot partitions, RPMB, GP partitions, FFU, hardware reset, command queuing
Certifications	RoHS, REACH, Halogen‑free
Part Number Decoder	KLM8G1GETF-B041: 8G=8GB, eMMC 5.1, B041 = firmware/configuration

✨ Key Features

✅ Samsung V‑NAND Technology – high density, low power, and enhanced endurance
✅ HS400 High Speed Interface – up to 320 MB/s read, reduces boot and load times
✅ Industrial Temperature Range – -25°C to +85°C for outdoor and industrial applications
✅ Integrated Controller – advanced wear leveling, bad block management, 60‑bit ECC
✅ Low Power Operation – ideal for battery‑powered and thermally constrained devices
✅ Enhanced Power‑off Protection – prevents data corruption during sudden power loss
✅ Field Firmware Update (FFU) – secure in‑system updates without device removal
✅ Partition Flexibility – boot partitions, RPMB, and up to 4 general purpose partitions
✅ JEDEC Standard Footprint – 153‑ball FBGA, drop‑in replacement for other eMMC modules
✅ Long‑term Availability – Samsung’s commitment for embedded and industrial markets

🎯 Target Applications:

Industrial control systems, networking routers/switches, medical monitors, digital signage, POS terminals, IoT gateways, single‑board computers, and portable embedded devices.

📦 Ordering Information

Orderable Part Number	Temperature	Package	Description
KLM8G1GETF-B041	-25°C to +85°C	153‑FBGA	8GB eMMC 5.1, industrial temp
KLM8G1GETF-B041 TR	-25°C to +85°C	153‑FBGA	Tape & Reel (200 pcs/reel)
KLM8G1GETF-B041 0B	-25°C to +85°C	153‑FBGA	Tray (160 pcs/tray)
KLM8G1GETF-B041 (AIT)	-40°C to +85°C	153‑FBGA	Automotive Grade 3 (contact Samsung)

🔍 Part Number Breakdown (KLM8G1GETF-B041):
• KLM – Samsung eMMC family
• 8G – 8 GB density
• 1G – NAND generation / controller type
• ETF – Vcc = 3.3V, Vccq = 1.8V or 3.3V, specific firmware
• B041 – Configuration / firmware version (HS400 supported, industrial temp)

🛠️ Software & Integration Support

Samsung KLM8G1GETF-B041 is supported by all major operating systems and SoCs:

🐧 Linux – kernel 4.4+ with native MMC driver, HS400 tuning supported

🪟 Windows IoT – fully compatible

📱 Android / AOSP – standard eMMC support

📄 Datasheet & Application Note – full register map, timing, and integration guide

💻 Driver & Tuning Guide – for HS400 calibration

🔄 Field Firmware Update Tool – available from Samsung support

🔒 Samsung Quality & Reliability

✅ AEC‑Q100 Grade 3 Option
Automotive qualified version available for -40°C to +85°C operation.

✅ High Endurance
3,000 P/E cycles typical, suitable for frequent write applications.

✅ Data Integrity
60‑bit ECC per 1KB, end‑to‑end data path protection.

Environmental Compliance: RoHS, REACH, Halogen‑free, and Conflict‑free (CFSI) certified. Samsung operates IATF 16949 and ISO 9001 certified manufacturing.

📄 Documentation & Support

Full datasheet (Rev. 2.1) – available on Samsung Memory Portal
Application notes: eMMC hardware integration and layout
IBIS models and simulation support
Direct field application engineering support

📦 Packaging & Logistics

Tray: 160 pieces per tray
Tape & Reel: 200 pieces per 13" reel
MSL Level 3 (per J‑STD‑020)
Lead‑free (SnAgCu) ball finish

FAQ

This device provides 8 GB of NAND flash managed by an integrated eMMC controller. The user‑accessible capacity is approximately 7.28 GiB after accounting for boot partitions, RPMB, and formatting overhead.