SAMSUNG_KLMBG2JETD-B041003
original

SAMSUNG
KLMBG2JETD-B041003

774-KLMBG2JETD-B041003
eMMC architecture for embedded memory
36 weeks

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APAC
ISO9001
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ISO14001
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Tech Specifications

Architecture
Sectored
HTS
8542.32.00.71
ECCN (US)
EAR99
PPAP
No
Package Length
13
Automotive
No
Mounting
Surface Mount
Chip Density (bit)
256G
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KLMBG2JETD-B041003 Description

eMMC architecture for embedded memory

FAQ

What is the standard lead time for KLMBG2JETD-B041003?
The standard lead time for KLMBG2JETD-B041003 is 36 weeks.
Are there related or alternative parts for KLMBG2JETD-B041003?
What voltage specification is listed for KLMBG2JETD-B041003?
What is KLMBG2JETD-B041003?
What is the mounting type of KLMBG2JETD-B041003?
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