


SAMSUNG
KLMBG2JETD-B041003
774-KLMBG2JETD-B041003
eMMC architecture for embedded memory
36 weeks
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Responsible qualityTech Specifications
Architecture
Sectored
HTS
8542.32.00.71
ECCN (US)
EAR99
PPAP
No
Package Length
13
Automotive
No
Mounting
Surface Mount
Chip Density (bit)
256G
KLMBG2JETD-B041003 Description
eMMC architecture for embedded memory
FAQ
What is the standard lead time for KLMBG2JETD-B041003?
The standard lead time for KLMBG2JETD-B041003 is 36 weeks.
Are there related or alternative parts for KLMBG2JETD-B041003?
What voltage specification is listed for KLMBG2JETD-B041003?
What is KLMBG2JETD-B041003?
What is the mounting type of KLMBG2JETD-B041003?



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