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SAMSUNG
KLMCG4JETD-B0410
774-KLMCG4JETD-B0410
NAND Flash Serial e-MMC 3V/3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin FBGA
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Tech Specifications
EU RoHS
Compliant
ECCN (US)
3A991.b.1.a
Part Status
Active
HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NAND
Chip Density (bit)
512G
KLMCG4JETD-B0410 Description
NAND Flash Serial e-MMC 3V/3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin FBGA
FAQ
What package or case is KLMCG4JETD-B0410 available in?
KLMCG4JETD-B0410 is available in the 0.71 package / case.
What operating temperature range does KLMCG4JETD-B0410 support?
What is the mounting type of KLMCG4JETD-B0410?
Are there related or alternative parts for KLMCG4JETD-B0410?
Is KLMCG4JETD-B0410 currently in stock?
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