Texas Instruments_66AK2H05DAAW2
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Texas Instruments
66AK2H05DAAW2

698-66AK2H05DAAW2
PDF Datasheet
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA 0 to 85
6 Weeks

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Tech Specifications

Max Operating Temperature
85
Number of Terminals
1517
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
R-PBGA-B1517
Width
40
Length
40
Temperature Grade
OTHER
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66AK2H05DAAW2 Description

66AK2H05DAAW2 Description

The 66AK2H05DAAW2 is a high-performance DSP+ARM® System on Chip (SoC) from Texas Instruments, part of the 66AK2Hx KeyStone Multicore series. This SoC is designed for demanding applications requiring both high-speed digital signal processing and robust ARM® processing capabilities. It operates within a temperature range of 0°C to 85°C, making it suitable for a variety of industrial and commercial environments. The device features a clock rate of 1.2GHz for the DSP and 1.4GHz for the ARM® core, ensuring rapid processing and efficient multitasking.

66AK2H05DAAW2 Features

The 66AK2H05DAAW2 offers a comprehensive set of features that make it a versatile and powerful SoC. Key features include:

  • Dual-Core Architecture: Combines a 1.2GHz DSP with a 1.4GHz ARM® core, providing a balanced blend of processing power and flexibility.
  • Non-Volatile Memory: Equipped with 384kB of ROM, ensuring reliable storage for critical firmware and boot code.
  • On-Chip RAM: 8.375MB of on-chip RAM provides ample space for high-speed data processing and temporary storage.
  • Variable Core Voltage: The core voltage is variable, allowing for optimization of power consumption based on the application's needs.
  • Multiple I/O Voltages: Supports a range of I/O voltages (0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V), enhancing compatibility with various peripheral devices.
  • Rich Interface Options: Includes EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, and USB 3.0 interfaces, facilitating seamless connectivity and communication.
  • Surface Mount Packaging: Available in a surface mount package, making it suitable for compact and high-density PCB designs.
  • Compliance and Safety: The device is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards.
  • Moisture Sensitivity Level (MSL): MSL 4 (72 Hours) ensures the device is protected against moisture during manufacturing processes.

66AK2H05DAAW2 Applications

The 66AK2H05DAAW2 is ideal for a wide range of applications that require high-performance processing and efficient data handling. Specific use cases include:

  • Industrial Automation: The combination of DSP and ARM® cores makes it suitable for real-time control and data processing in industrial environments.
  • Telecommunications: The robust processing capabilities and rich interface options make it ideal for base stations, routers, and other telecom equipment.
  • Medical Devices: The high reliability and performance are crucial for medical imaging and diagnostic equipment.
  • Automotive Systems: The SoC's ability to handle complex algorithms and real-time data processing makes it suitable for advanced driver assistance systems (ADAS) and infotainment systems.
  • Consumer Electronics: The versatile interface options and high performance make it a good fit for smart TVs, gaming consoles, and other consumer electronics.

Conclusion of 66AK2H05DAAW2

The 66AK2H05DAAW2 from Texas Instruments is a powerful and versatile SoC that combines high-performance DSP and ARM® processing capabilities. Its dual-core architecture, extensive interface options, and compliance with industry standards make it an excellent choice for a variety of demanding applications. Whether used in industrial automation, telecommunications, medical devices, automotive systems, or consumer electronics, the 66AK2H05DAAW2 offers reliable performance and efficient data handling, ensuring it remains a top choice for engineers and designers in the electronics industry.

FAQ

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