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Heat Sinks
(163 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 015537Heat Sinks | congatec | Standard Heat spreader for Qseven Module Conga-QA5 with Open Silicon Pentium and Celeron processor | In Stock | - | |
42051Heat Sinks | congatec | Standard Heat Spreader for COM Express module | In Stock | - | |
47352Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
47750Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
15190Heat Sinks | congatec | Heat Sink Spreader | In Stock | - | |
016160Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
15192Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
 CONGA-PA7/I-HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are M2.5 thread. | 2 | - | |
 CONGA-SMX8-MINI/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-XLX/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader for conga-XLX, standoff with 2.7mm bore hole | In Stock | - | |
 CONGA-SA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
 CONGA-TS170/CSA-HP-BHeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
TC670/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | In Stock | - | |
 CONGA-MA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 23 | - | |
 CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | In Stock | - | |
 CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-TS170/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-TCA3/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are 2.7mm bore hole. | In Stock | - | |
 CONGA-QA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-PA5/I-HSP-BHeat Sinks | congatec | Heat Sinks conga-PA5/i-HSP-B | 12 | - | |
HPC/SILL-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | In Stock | - |
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