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Heat Sinks
(163 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 016161Heat Sinks | congatec | Standard heat Spreader with 2mm Gap Pad | In Stock | - | |
15062Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
41351Heat Sinks | congatec | Standard Heat Spreader for High Performance COM Express Module | In Stock | - | |
42054Heat Sinks | congatec | Standard Passive Cooling Device | In Stock | - | |
46954Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
47351Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
16162Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
46454Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
SMX8-X/I-HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. | 21 | - | |
 CONGA-TCA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-TS170/CSA-HP-THeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-MA3/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread. | In Stock | - | |
CONGA-B7XD/HSP-CU-BHeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-B | In Stock | - | |
 CONGA-PA7/HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors . All standoffs are M2.5 thread. | In Stock | - | |
 CONGA-TC570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QA3/HSP-BHeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | 32 | - | |
 CONGA-QA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga QA7 with open die Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TC700/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-TS570/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-B7XD/HSP-CU-THeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-T | In Stock | - | |
HPC/CALP-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. | In Stock | - | |
CONGA-TCA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-QMX8-PLUS/HSP-THeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TC570/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. | In Stock | - |
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