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Heat Sinks
(163 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 CONGA-TCA7/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-STDA4/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM | In Stock | - | |
 CONGA-MA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
 CONGA-XLX/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader for conga-XLX, standoff with 2.7mm bore hole | In Stock | - | |
 CONGA-TCA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-TC570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-MA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-TCA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-HPC/CTLU-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 1 | - | |
 CONGA-QA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | In Stock | - | |
JC370/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm. | In Stock | - | |
 CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TCR8/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | In Stock | - | |
TCV2/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | In Stock | - | |
 CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-QA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-MA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 1 | - | |
HPC/SILH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | In Stock | - | |
 CONGA-QA3/HSP-THeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | In Stock | - | |
CONGA-UMX6/HSP3-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants. | In Stock | - | |
CONGA-B7XD/HSP-CU-THeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-T | In Stock | - |
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