AMD_XC7K160T-L2FFG676I
original

AMD
XC7K160T-L2FFG676I

696-XC7K160T-L2FFG676I
IC FPGA 400 I/O 676FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
11980800
Number of LABs/CLBs
12675
ECCN
3A991D
Number of I/O
400
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FCBGA (27x27)
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XC7K160T-L2FFG676I Description

XC7K160T-L2FFG676I Overview

With a fictitious threat of 49% on the open market, the gadget enjoys significant consumer popularity. The equilibrium between supply and demand is present. The Win Source Part Number for this component is 939631-XC7K160T-L2FFG676I, and it has a 400 I/O series Field Programmable Gate Array (FPGA) IC. The package has a quantity of 1 and is a 676-BBGA, FCBGA. The projected lead time for manufacturing is 51 weeks, and the MSL Level is 4 (72 hours). The HTSUS is 8542.39.0001, and the REACH status is REACH Unaffected.

XC7K160T-L2FFG676I Features

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

High-performance SelectIOtechnology with support for DDR3 interfaces up to 1,866 Mb/s.

High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

A user-configurable analogue interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

XC7K160T-L2FFG676I Applications

Wireless Technology

Industrial Control

Internet of Things

Medical Equipment

Consumer Electronics

FAQ

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Yes. XC7K160T-L2FFG676I currently has 1 pricing tier(s), starting from 1 units.
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