AMD_XC7K325T-L2FBG676I
original

AMD
XC7K325T-L2FBG676I

696-XC7K325T-L2FBG676I
IC FPGA 400 I/O 676FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
16404480
Number of LABs/CLBs
25475
ECCN
3A991D
Number of I/O
400
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FCBGA (27x27)
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XC7K325T-L2FBG676I Description

The XC7K325T-L2FBG676I is a high-performance Field Programmable Gate Array (FPGA) from AMD. This device is designed for a wide range of applications, including high-speed data processing, networking, and communication systems.

Description:

The XC7K325T-L2FBG676I is a member of the Kintex-7 family of FPGAs, which are known for their high performance, low power consumption, and advanced features. This device is packaged in a flip-chip ball grid array (FCBGA) package with a total of 676 I/Os, making it suitable for a wide range of applications.

Features:

  1. High Performance: The XC7K325T-L2FBG676I offers high-speed performance with a maximum operating frequency of up to 1.5 GHz. This makes it suitable for applications that require fast data processing and high-speed communication.
  2. Low Power Consumption: The device is designed to operate with low power consumption, making it ideal for energy-efficient applications.
  3. Advanced Features: The XC7K325T-L2FBG676I includes advanced features such as hardened memory blocks, digital signal processing (DSP) blocks, and high-speed transceivers, which can be used for a wide range of applications.
  4. High I/O Count: With a total of 676 I/Os, the device offers a high I/O count, making it suitable for applications that require a large number of input/output connections.
  5. Versatile Package: The flip-chip ball grid array (FCBGA) package provides a versatile and compact form factor, making it suitable for a wide range of applications.

Applications:

The XC7K325T-L2FBG676I is suitable for a wide range of applications, including:

  1. High-Speed Data Processing: The high-performance capabilities of the device make it suitable for applications that require fast data processing, such as image and video processing, data analytics, and machine learning.
  2. Networking and Communication Systems: The device's high-speed transceivers and low power consumption make it ideal for networking and communication systems, such as routers, switches, and base stations.
  3. Industrial Automation: The device's versatility and high I/O count make it suitable for industrial automation applications, such as motor control, robotics, and process control.
  4. Automotive Systems: The XC7K325T-L2FBG676I can be used in automotive systems, such as advanced driver assistance systems (ADAS), infotainment systems, and powertrain control.
  5. Aerospace and Defense: The device's high reliability and performance make it suitable for aerospace and defense applications, such as radar systems, satellite communication, and electronic warfare.

In summary, the AMD XC7K325T-L2FBG676I is a high-performance FPGA with advanced features, low power consumption, and a high I/O count, making it suitable for a wide range of applications in various industries.

FAQ

What operating temperature range does XC7K325T-L2FBG676I support?
XC7K325T-L2FBG676I has an operating temperature range of -40°C ~ 100°C (TJ).
What is the mounting type of XC7K325T-L2FBG676I?
What is the standard lead time for XC7K325T-L2FBG676I?
What package or case is XC7K325T-L2FBG676I available in?
What is XC7K325T-L2FBG676I?
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