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XC7K325T-L2FBG900E

XC7K325T-L2FBG900E Overview

XC7K325T-L2FBG900E is a Kintex-7 series field programmable gate array (FPGA) IC having 500 I/Os. It is packaged in a tray with a 900-BBGA, FCBGA container size. It can function in a temperature range of 0°C to 100°C (TJ) and is surface mountable. This IC has an ECCN of 3A991D and is not impacted by the Reach. This product's HTSUS code is 8542.39.0001. It enjoys high levels of popularity and stable supply and demand. The production lead time for this product is predicted to be 51 weeks. This concept is frequently encountered in a variety of electronic applications.

XC7K325T-L2FBG900E Features

Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.

XC7K325T-L2FBG900E Applications

Consumer Electronics

Artificial Intelligence

5G Technology

Cloud Computing

Wireless Technology