AMD_XCKU11P-1FFVE1517E
original

AMD
XCKU11P-1FFVE1517E

696-XCKU11P-1FFVE1517E
IC FPGA 512 I/O 1517FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
53964800
Number of LABs/CLBs
37320
ECCN
3A001A7B
Number of I/O
512
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1517-FCBGA (40x40)
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XCKU11P-1FFVE1517E Description

AMD's XCKU11P-1FFVE1517E is a high-performance integrated circuit that is designed to meet the demands of modern electronic systems. This device is part of AMD's extensive range of products that are engineered to deliver exceptional performance, reliability, and efficiency.

Description:

The XCKU11P-1FFVE1517E is a System in Package (SiP) device that integrates multiple components into a single package. It is designed to provide a compact, high-performance solution for a wide range of applications. The device features a high-speed serial interface and a flexible I/O configuration, making it suitable for use in a variety of electronic systems.

Features:

  1. High-speed serial interface: The XCKU11P-1FFVE1517E features a high-speed serial interface that enables fast data transfer rates and efficient communication between components.
  2. Flexible I/O configuration: The device offers a flexible I/O configuration, allowing it to be easily integrated into a wide range of electronic systems.
  3. Compact form factor: The XCKU11P-1FFVE1517E is designed in a compact form factor, making it suitable for use in space-constrained applications.
  4. Robust performance: The device is engineered to deliver robust performance, even in challenging operating conditions.
  5. High reliability: The XCKU11P-1FFVE1517E is built to meet the highest standards of reliability, ensuring consistent operation over time.

Applications:

The XCKU11P-1FFVE1517E is suitable for use in a wide range of applications, including:

  1. Networking and communication systems: The high-speed serial interface and flexible I/O configuration make the XCKU11P-1FFVE1517E an ideal choice for networking and communication systems.
  2. Industrial control systems: The device's robust performance and high reliability make it well-suited for use in industrial control systems.
  3. Consumer electronics: The compact form factor and high-performance capabilities of the XCKU11P-1FFVE1517E make it an excellent choice for consumer electronics applications.
  4. Automotive systems: The XCKU11P-1FFVE1517E can be used in automotive systems, where high reliability and performance are critical.
  5. Aerospace and defense: The device's robust performance and high reliability make it suitable for use in aerospace and defense applications, where performance and reliability are paramount.

In summary, AMD's XCKU11P-1FFVE1517E is a high-performance integrated circuit that offers a range of features and benefits, making it suitable for use in a wide range of applications. Its compact form factor, high-speed serial interface, and flexible I/O configuration make it an ideal choice for modern electronic systems that demand exceptional performance, reliability, and efficiency.

FAQ

What package or case is XCKU11P-1FFVE1517E available in?
XCKU11P-1FFVE1517E is available in the 1517-BBGA, FCBGA package / case.
What is XCKU11P-1FFVE1517E?
Are there related or alternative parts for XCKU11P-1FFVE1517E?
What is the mounting type of XCKU11P-1FFVE1517E?
What is the standard lead time for XCKU11P-1FFVE1517E?
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