AMD_XCKU19P-3FFVJ1760E
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AMD
XCKU19P-3FFVJ1760E

696-XCKU19P-3FFVJ1760E
IC FPGA KINTEX UP 1760FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
63753421
Number of LABs/CLBs
105300
ECCN
3A001A7B
Number of I/O
540
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
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XCKU19P-3FFVJ1760E Description

AMD's XCKU19P-3FFVJ1760E is a high-performance integrated circuit designed for a wide range of applications. This model is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and innovative solutions.

Description:

The XCKU19P-3FFVJ1760E is a Field Programmable Gate Array (FPGA) that offers a high level of integration and flexibility. It is based on a 28-nanometer technology node and features a high-speed transceiver, which allows for faster data transmission and improved performance. The device is available in a flip-chip ball grid array (FCBGA) package, which provides a compact and efficient form factor.

Features:

  1. Advanced 28-nanometer technology node for improved performance and power efficiency.
  2. High-speed transceiver for faster data transmission and reduced latency.
  3. Large programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and digital signal processing (DSP) blocks.
  4. Integrated Block RAM (BRAM) for high-density storage and efficient data handling.
  5. High I/O count for flexible connectivity and interface options.
  6. Support for various industry-standard protocols, such as PCI Express, Gigabit Ethernet, and DDR memory interfaces.
  7. Advanced power management features to optimize power consumption and thermal performance.
  8. Robust design and manufacturing process for reliable operation in various environments.

Applications:

The XCKU19P-3FFVJ1760E is suitable for a wide range of applications that require high-performance, flexible, and power-efficient solutions. Some of the key application areas include:

  1. Networking and communications: The high-speed transceiver and support for industry-standard protocols make this FPGA ideal for networking equipment, such as routers, switches, and base stations.
  2. Video processing: The device's programmable logic resources and high I/O count enable advanced video processing applications, such as image and signal processing, video encoding, and decoding.
  3. Industrial automation and control: The FPGA's flexibility and programmability make it suitable for implementing complex control algorithms and interfacing with various sensors and actuators in industrial automation systems.
  4. Automotive: The XCKU19P-3FFVJ1760E can be used in advanced driver assistance systems (ADAS), infotainment systems, and other automotive applications that require high-performance processing and real-time data handling.
  5. Aerospace and defense: The FPGA's robust design and manufacturing process make it suitable for use in aerospace and defense applications, where reliability and performance are critical.
  6. Data centers: The device's high-speed transceiver and support for industry-standard protocols make it suitable for use in data center applications, such as network function virtualization (NFV) and storage systems.

In summary, the AMD XCKU19P-3FFVJ1760E is a high-performance FPGA that offers a wide range of features and applications. Its advanced technology, flexible programmability, and efficient power management make it an ideal choice for various industries and applications that require high-performance and reliable solutions.

FAQ

What package or case is XCKU19P-3FFVJ1760E available in?
XCKU19P-3FFVJ1760E is available in the 1760-BBGA, FCBGA package / case.
What voltage specification is listed for XCKU19P-3FFVJ1760E?
What is the standard lead time for XCKU19P-3FFVJ1760E?
What operating temperature range does XCKU19P-3FFVJ1760E support?
Are there related or alternative parts for XCKU19P-3FFVJ1760E?
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