AMD

XCVM1802-2MSIVSVD1760  

System On Chip (SoC)

XCVM1802-2MSIVSVD1760 Description

The XCVM1802-2MSIVSVD1760 is a high-performance System on Chip (SoC) from AMD's Versal™ Prime series, designed to deliver exceptional processing capabilities and flexibility. This IC integrates a powerful 1.9M logic cell FPGA with a multi-processing unit (MPU) architecture, offering dual-speed operation at 600MHz and 1.4GHz. The device is equipped with 256KB of RAM and supports a robust set of peripherals, including DDR, DMA, and PCIe, making it suitable for a wide range of complex applications.

XCVM1802-2MSIVSVD1760 Features

• Dual-Speed Operation: With speeds of 600MHz and 1.4GHz, the XCVM1802-2MSIVSVD1760 offers versatile performance options, allowing it to handle both high-speed and low-power applications efficiently.
• Architecture: The MPU and FPGA architecture provides a combination of programmable logic and processing power, enabling the device to perform complex tasks with high efficiency.
• RAM Size: The 256KB of RAM ensures that the device can handle substantial data processing tasks without frequent memory access delays.
• I/O Capability: With 726 I/O pins, the XCVM1802-2MSIVSVD1760 offers extensive connectivity options, making it suitable for applications requiring multiple interfaces.
• Peripheral Support: The device supports a comprehensive set of peripherals, including DDR, DMA, and PCIe, enhancing its versatility and integration capabilities.
• Connectivity: The XCVM1802-2MSIVSVD1760 features a wide range of connectivity options, such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it ideal for applications requiring extensive communication capabilities.
• Package and Compliance: The device is available in a tray package and is ROHS3 compliant, ensuring environmental sustainability and regulatory adherence.
• Moisture Sensitivity Level: With an MSL of 4 (72 hours), the XCVM1802-2MSIVSVD1760 is suitable for environments with moderate moisture levels, ensuring reliability and durability.

XCVM1802-2MSIVSVD1760 Applications

The XCVM1802-2MSIVSVD1760 is ideal for applications requiring high computational power and extensive connectivity. Some specific use cases include:

• Data Centers: The device's high-speed processing capabilities and extensive I/O options make it suitable for data center applications, where it can handle large volumes of data efficiently.
• Industrial Automation: The robust connectivity options, including CANbus and Ethernet, make it ideal for industrial automation systems, where reliable communication and control are critical.
• Embedded Systems: The combination of MPU and FPGA architecture allows the XCVM1802-2MSIVSVD1760 to be used in embedded systems, where it can perform both processing and control functions.
• Telecommunications: The device's extensive communication capabilities, including Ethernet and USB OTG, make it suitable for telecommunications applications, where it can handle data transmission and processing tasks.

Conclusion of XCVM1802-2MSIVSVD1760

The XCVM1802-2MSIVSVD1760 from AMD's Versal™ Prime series is a versatile and powerful SoC, offering a unique combination of processing power, programmable logic, and extensive connectivity options. Its dual-speed operation, robust architecture, and comprehensive peripheral support make it an ideal choice for a wide range of applications, from data centers to industrial automation. The device's compliance with environmental standards and its reliability in moderate moisture environments further enhance its appeal. For engineers and designers looking for a high-performance, flexible SoC, the XCVM1802-2MSIVSVD1760 is a compelling option.

XCVM1802-2MSIVSVD1760 Documents

Download datasheets and manufacturer documentation for XCVM1802-2MSIVSVD1760