AMD

XCVM1802-1MSIVSVD1760  

System On Chip (SoC)

XCVM1802-1MSIVSVD1760 Description

The XCVM1802-1MSIVSVD1760 is a high-performance Embedded IC Chip from AMD's Versal™ Prime series, designed to deliver exceptional processing capabilities and flexibility. This IC features a dual-core architecture with speeds of 600MHz and 1.3GHz, making it suitable for demanding applications that require high computational power. The device integrates a powerful MPU and FPGA, offering a versatile platform for a wide range of embedded systems.

XCVM1802-1MSIVSVD1760 Features

• High-Speed Processing: The XCVM1802-1MSIVSVD1760 operates at speeds of up to 1.3GHz, providing rapid data processing and real-time performance.
• Robust Architecture: Combining a MPU and FPGA, this IC offers a flexible architecture that can be tailored to specific application needs.
• Substantial RAM: Equipped with 256KB of RAM, the device ensures efficient data handling and storage.
• Extensive I/O Capabilities: With 726 I/O pins, the XCVM1802-1MSIVSVD1760 supports a wide array of peripherals and connectivity options, including DDR, DMA, and PCIe.
• Rich Peripheral Set: The IC includes essential peripherals such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile.
• ROHS3 Compliant: The XCVM1802-1MSIVSVD1760 is environmentally friendly, adhering to the latest ROHS3 standards.
• Moisture Sensitivity Level (MSL): The device has an MSL of 4 (72 Hours), ensuring reliability in various environmental conditions.
• Packaging: Available in a Tray package, the IC is suitable for both prototyping and mass production.

XCVM1802-1MSIVSVD1760 Applications

The XCVM1802-1MSIVSVD1760 is ideal for applications that demand high performance and flexibility. Its dual-core architecture and extensive I/O capabilities make it suitable for:

• Advanced Networking: The IC's high-speed processing and extensive connectivity options make it perfect for high-performance networking equipment.
• Industrial Automation: The robust architecture and I/O capabilities support complex automation systems, ensuring reliable operation in demanding industrial environments.
• Embedded Systems: The device's flexibility and extensive peripheral set make it ideal for a wide range of embedded systems, from consumer electronics to medical devices.
• Data Processing: The high RAM capacity and processing speed enable efficient data handling, making it suitable for applications that require real-time data processing.

Conclusion of XCVM1802-1MSIVSVD1760

The XCVM1802-1MSIVSVD1760 is a versatile and high-performance Embedded IC Chip that stands out in its category. Its dual-core architecture, extensive I/O capabilities, and rich peripheral set make it a powerful solution for a wide range of applications. The device's compliance with ROHS3 standards and its MSL of 4 (72 Hours) ensure reliability and environmental sustainability. Whether for advanced networking, industrial automation, or complex embedded systems, the XCVM1802-1MSIVSVD1760 offers a reliable and efficient solution, making it a standout choice in the electronics industry.

XCVM1802-1MSIVSVD1760 Documents

Download datasheets and manufacturer documentation for XCVM1802-1MSIVSVD1760

Datasheets :

Versal Prime Product Selection Guide       Versal Prime Series       Versal Overview