AMD

XCVM1802-1LSIVSVD1760  

System On Chip (SoC)

XCVM1802-1LSIVSVD1760 Description

The XCVM1802-1LSIVSVD1760 is a high-performance System on Chip (SoC) developed by AMD, featuring the Versal™ Prime series architecture. This IC integrates a powerful 1.9M logic cell FPGA with a dual-core ARM Cortex-A72 processor, offering exceptional processing capabilities and flexibility. The device supports a wide range of speeds, including 400MHz and 1GHz, making it suitable for demanding applications that require high computational power and efficient data processing.

XCVM1802-1LSIVSVD1760 Features

• Architecture: The XCVM1802-1LSIVSVD1760 combines a multi-processing unit (MPU) with a field-programmable gate array (FPGA), providing a versatile platform for both general-purpose computing and specialized hardware acceleration.
• RAM Size: Equipped with 256KB of RAM, this SoC ensures efficient data handling and quick access for various applications.
• I/O Capability: With 726 I/O pins, the XCVM1802-1LSIVSVD1760 offers extensive connectivity options, enabling seamless integration with a wide array of peripherals and external devices.
• Peripheral Support: The device supports DDR, DMA, and PCIe, facilitating high-speed data transfer and efficient memory management.
• Connectivity: The XCVM1802-1LSIVSVD1760 features a comprehensive suite of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for a variety of industrial and embedded applications.
• Package: The device is available in a tray package, ensuring robustness and ease of integration into various systems.
• RoHS Compliance: The XCVM1802-1LSIVSVD1760 is ROHS3 compliant, adhering to stringent environmental standards and ensuring suitability for global markets.
• Moisture Sensitivity Level (MSL): With an MSL of 4 (72 Hours), the device is designed to withstand moderate levels of moisture, making it reliable for various environmental conditions.

XCVM1802-1LSIVSVD1760 Applications

The XCVM1802-1LSIVSVD1760 is ideal for applications that require high computational power, flexibility, and extensive connectivity. Some specific use cases include:

• Industrial Automation: The device's robust connectivity and processing capabilities make it suitable for controlling complex industrial processes and systems.
• Embedded Systems: Its versatile architecture and extensive I/O options make it an excellent choice for developing advanced embedded systems that require real-time processing and efficient data handling.
• Networking: The support for Ethernet and PCIe enables the XCVM1802-1LSIVSVD1760 to be used in networking applications, such as routers and switches, where high-speed data transfer and processing are critical.
• Automotive: The device's capabilities and compliance with environmental standards make it suitable for automotive applications, including advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.

Conclusion of XCVM1802-1LSIVSVD1760

The XCVM1802-1LSIVSVD1760 is a versatile and powerful SoC that offers a unique combination of processing power, flexibility, and extensive connectivity options. Its integration of a high-performance MPU and FPGA, along with a comprehensive suite of peripherals and connectivity features, makes it an ideal solution for a wide range of applications in the electronics industry. The device's compliance with environmental standards and robustness further enhance its suitability for various market segments. For developers and engineers seeking a reliable and high-performance SoC, the XCVM1802-1LSIVSVD1760 is a compelling choice.

XCVM1802-1LSIVSVD1760 Documents

Download datasheets and manufacturer documentation for XCVM1802-1LSIVSVD1760

Datasheets :

Versal Prime Product Selection Guide       Versal Prime Series       Versal Overview