AMD_XCVU13P-1FLGA2577I
AMD_XCVU13P-1FLGA2577I
original

AMD
XCVU13P-1FLGA2577I

696-XCVU13P-1FLGA2577I
IC FPGA 448 I/O 2577FCBGA
20 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
514867200
Number of LABs/CLBs
216000
ECCN
3A001A7B
Number of I/O
448
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
2577-FCBGA (52.5x52.5)
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XCVU13P-1FLGA2577I Description

AMD's XCVU13P-1FLGA2577I is a high-performance integrated circuit (IC) designed for use in a variety of applications, including industrial and automotive systems. This IC is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and solutions.

Description:

The XCVU13P-1FLGA2577I is a Field Programmable Gate Array (FPGA) that features a high-density architecture and advanced I/O capabilities. It is built on a 28-nanometer process technology and offers a combination of logic cells, digital signal processing (DSP) blocks, and memory resources. The device is available in a flip-chip ball grid array (FCBGA) package, which provides a high level of integration and reliability.

Features:

  1. High-density architecture: The XCVU13P-1FLGA2577I offers a high-density architecture, providing a large number of logic cells, DSP blocks, and memory resources in a compact form factor.
  2. Advanced I/O capabilities: The device features a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O capabilities, making it suitable for a variety of applications.
  3. Low power consumption: The 28-nanometer process technology used in the XCVU13P-1FLGA2577I results in low power consumption, making it an energy-efficient solution for various applications.
  4. High reliability: The flip-chip ball grid array (FCBGA) package provides a high level of reliability and robustness, making it suitable for use in harsh environments.
  5. Versatility: The XCVU13P-1FLGA2577I can be programmed to perform a wide range of functions, making it a versatile solution for various applications.

Applications:

The XCVU13P-1FLGA2577I is suitable for a wide range of applications, including:

  1. Industrial control systems: The device's high-density architecture and advanced I/O capabilities make it ideal for use in complex industrial control systems, where high-speed data processing and communication are required.
  2. Automotive systems: The XCVU13P-1FLGA2577I can be used in various automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and powertrain control.
  3. Networking and communications: The high-speed transceivers and versatile I/O capabilities of the XCVU13P-1FLGA2577I make it suitable for use in networking and communications equipment, such as routers, switches, and base stations.
  4. Aerospace and defense: The device's high reliability and performance make it suitable for use in aerospace and defense applications, where high levels of reliability and performance are critical.
  5. Data centers: The XCVU13P-1FLGA2577I can be used in data center applications, such as network function virtualization (NFV) and software-defined networking (SDN), where high-speed data processing and flexibility are required.

In summary, AMD's XCVU13P-1FLGA2577I is a high-performance FPGA that offers a combination of high-density architecture, advanced I/O capabilities, low power consumption, and high reliability. Its versatility makes it suitable for a wide range of applications, including industrial control systems, automotive systems, networking and communications, aerospace and defense, and data centers.

FAQ

What package or case is XCVU13P-1FLGA2577I available in?
XCVU13P-1FLGA2577I is available in the 2577-BBGA, FCBGA package / case.
What voltage specification is listed for XCVU13P-1FLGA2577I?
Does XCVU13P-1FLGA2577I have quantity-based pricing?
Are there related or alternative parts for XCVU13P-1FLGA2577I?
Is XCVU13P-1FLGA2577I currently in stock?
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