AMD_XCZU48DR-2FFVE1156E
original

AMD
XCZU48DR-2FFVE1156E

777-XCZU48DR-2FFVE1156E
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.333GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DDR, DMA, PCIe
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XCZU48DR-2FFVE1156E Description

XCZU48DR-2FFVE1156E Description

The XCZU48DR-2FFVE1156E is a high-performance, multi-functional IC chip from the Zynq® UltraScale+™ RFSoC series, manufactured by AMD. This embedded IC chip is designed to deliver exceptional performance and versatility, making it ideal for a wide range of applications in the electronics industry. The XCZU48DR-2FFVE1156E features a dual-core ARM Cortex-A53 processor, integrated with a powerful FPGA fabric, providing a seamless blend of processing and programmable logic capabilities.

XCZU48DR-2FFVE1156E Features

  • Architecture: The XCZU48DR-2FFVE1156E combines a dual-core ARM Cortex-A53 MCU with a high-capacity FPGA, offering a flexible and powerful architecture for complex system designs.
  • Speed: The device supports clock speeds of up to 533MHz and 1.333GHz, ensuring high-speed processing and data handling capabilities.
  • Operating Temperature: It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a variety of environmental conditions.
  • RAM Size: Equipped with 256KB of RAM, the XCZU48DR-2FFVE1156E can efficiently manage data storage and retrieval tasks.
  • I/O Capability: The chip features 366 I/O pins, providing extensive connectivity options for various peripherals and interfaces.
  • Peripherals: It supports a wide range of peripherals, including DDR, DMA, and PCIe, enhancing its compatibility and functionality.
  • Connectivity: The XCZU48DR-2FFVE1156E offers robust connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for different applications.
  • Package: Available in a Tray package, it ensures reliable handling and integration into various electronic systems.
  • RoHS Compliance: The device is ROHS3 compliant, adhering to environmental standards and regulations.
  • Moisture Sensitivity Level (MSL): With an MSL of 4 (72 Hours), it is designed to withstand moisture exposure during manufacturing processes.

XCZU48DR-2FFVE1156E Applications

The XCZU48DR-2FFVE1156E is ideal for applications requiring high performance, flexibility, and advanced connectivity. Some specific use cases include:

  • Telecommunications: Ideal for 5G base stations, where high-speed data processing and low-latency communication are critical.
  • Automotive: Suitable for advanced driver-assistance systems (ADAS) and autonomous driving applications, where real-time processing and reliability are paramount.
  • Industrial Automation: Perfect for industrial control systems, where the device's robust connectivity and processing capabilities can enhance system efficiency and reliability.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment, where precise data processing and high-speed performance are essential.
  • Aerospace and Defense: Ideal for mission-critical systems that require high reliability, advanced processing capabilities, and secure communication.

Conclusion of XCZU48DR-2FFVE1156E

The XCZU48DR-2FFVE1156E stands out as a versatile and high-performance embedded IC chip, offering a unique blend of processing power and programmable logic. Its advanced architecture, extensive connectivity options, and robust I/O capabilities make it a standout choice for demanding applications across various industries. With its active product status and compliance with industry standards, the XCZU48DR-2FFVE1156E is poised to meet the evolving needs of modern electronics, ensuring reliable and efficient system performance.

FAQ

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