Intel_AGFD019R25A1I1V
Intel_AGFD019R25A1I1V
original

Intel
AGFD019R25A1I1V

777-AGFD019R25A1I1V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R25A1I1V Description

AGFD019R25A1I1V Description

The AGFD019R25A1I1V is a high-performance Embedded IC Chip from Intel's Agilex F series, designed to deliver exceptional processing capabilities and flexibility for a wide range of embedded applications. This IC features a powerful 1.4GHz processing speed, combining a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA) architecture to provide both programmable logic and processing power. With 256KB of RAM and 480 I/Os, the AGFD019R25A1I1V is well-suited for complex computing tasks and extensive connectivity requirements.

AGFD019R25A1I1V Features

High-Speed Processing and Architecture:

  • Speed: The AGFD019R25A1I1V operates at a speed of 1.4GHz, ensuring rapid processing capabilities.
  • Architecture The: MPU and FPGA architecture offers a versatile combination of programmable logic and processing power, making it suitable for both general-purpose computing and specialized tasks.

Memory and I/O:

  • RAM Size: Equipped with 256KB of RAM, this IC can handle significant data processing and storage needs.
  • Number of I/O: With 480 I/Os, the AGFD019R25A1I1V provides extensive connectivity options, enabling integration with a wide variety of peripherals and systems.

Peripherals and Connectivity:

  • Peripherals: The AGFD019R25A1I1V includes Direct Memory Access (DMA) and Watchdog Timer (WDT) peripherals, enhancing its functionality and reliability.
  • Connectivity: This IC supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for various embedded applications.

Product Status and Packaging:

  • Product Status: The AGFD019R25A1I1V is an active product, ensuring continued support and availability.
  • Package: It is available in a Tray package, which is ideal for manufacturing and assembly processes.
  • Moisture Sensitivity Level (MSL): The MSL rating of 3 (168 Hours) ensures that the IC can be safely handled and stored in typical manufacturing environments.

AGFD019R25A1I1V Applications

The AGFD019R25A1I1V is ideal for a variety of applications where high performance, flexibility, and extensive connectivity are required. Some specific use cases include:

  • Industrial Automation: The combination of MPU and FPGA architecture makes it suitable for complex control systems and real-time processing tasks in industrial environments.
  • Telecommunications: The extensive connectivity options, including Ethernet and USB OTG, make it ideal for communication infrastructure and network devices.
  • Consumer Electronics: The AGFD019R25A1I1V can be used in advanced consumer electronics, such as smart home devices and IoT gateways, where high-speed processing and multiple I/Os are necessary.
  • Medical Devices: The reliability and extensive peripheral support make it suitable for medical equipment that requires precise control and data processing.

Conclusion of AGFD019R25A1I1V

The AGFD019R25A1I1V from Intel's Agilex F series is a versatile and powerful Embedded IC Chip that offers a unique combination of high-speed processing, flexible architecture, and extensive connectivity. Its 1.4GHz speed, MPU and FPGA architecture, 256KB RAM, and 480 I/Os make it an excellent choice for a wide range of embedded applications. The inclusion of DMA and WDT peripherals, along with its robust connectivity options, further enhance its functionality. With an active product status and a Tray package, the AGFD019R25A1I1V is well-suited for manufacturing and assembly processes. Whether used in industrial automation, telecommunications, consumer electronics, or medical devices, the AGFD019R25A1I1V provides reliable performance and extensive capabilities, making it a standout choice in the embedded IC market.

FAQ

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The standard lead time for AGFD019R25A1I1V is 12 Weeks.
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