Micron Technology_MT53E256M32D2DS-053 WT:B

Micron Technology
MT53E256M32D2DS-053 WT:B  
Memory ICs Products

Micron Technology
MT53E256M32D2DS-053 WT:B
774-MT53E256M32D2DS-053 WT:B
IC DRAM 8GBIT 1.866GHZ 200WFBGA
In Stock : 464

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MT53E256M32D2DS-053 WT:B Description

MT53E256M32D2DS-053 WT:B Description

The MT53E256M32D2DS-053 WT:B is a high-performance, 8Gbit DRAM IC designed for demanding applications requiring significant memory capacity and fast data access. Manufactured by Micron Technology Inc., this IC features a clock frequency of 1.866 GHz, ensuring rapid data processing and efficient performance. The memory is organized in a 256M x 32 configuration, providing a robust structure for handling large datasets and complex operations.

This DRAM IC is packaged in a 200-ball WFBGA format, which is ideal for surface mount applications. It operates at a supply voltage of 1.1V, making it energy-efficient and suitable for systems where power consumption is a critical consideration. The MT53E256M32D2DS-053 WT:B is classified under ECCN EAR99 and HTSUS 8542.32.0036, and it is ROHS3 compliant, ensuring it meets environmental and safety standards.

MT53E256M32D2DS-053 WT:B Features

  • High Capacity and Performance: With an 8Gbit memory size and a clock frequency of 1.866 GHz, the MT53E256M32D2DS-053 WT:B offers significant storage and fast data access, making it suitable for high-speed computing applications.
  • Efficient Power Consumption: Operating at a supply voltage of 1.1V, this IC is designed to minimize power usage without compromising performance.
  • Robust Memory Organization: The 256M x 32 memory organization ensures efficient data management and retrieval, supporting complex operations and large datasets.
  • Surface Mount Compatibility: The 200WFBGA package is ideal for surface mount applications, providing a compact and reliable solution for modern electronic systems.
  • Environmental Compliance: ROHS3 compliance ensures that the MT53E256M32D2DS-053 WT:B meets stringent environmental standards, making it suitable for a wide range of applications.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the IC is designed to withstand moderate levels of moisture, ensuring reliability in various environmental conditions.

MT53E256M32D2DS-053 WT:B Applications

The MT53E256M32D2DS-053 WT:B is ideal for applications requiring high-speed data processing and significant memory capacity. Some specific use cases include:

  • High-Performance Computing: Suitable for servers and data centers where large datasets and complex computations are common.
  • Networking Equipment: Ideal for routers and switches that require fast data access and processing.
  • Telecommunications: Applicable in base stations and other telecommunication infrastructure that demand high-speed memory solutions.
  • Consumer Electronics: Can be used in high-end gaming consoles and multimedia devices where fast data retrieval is crucial.

Conclusion of MT53E256M32D2DS-053 WT:B

The MT53E256M32D2DS-053 WT:B is a powerful and efficient DRAM IC designed to meet the demands of high-speed, high-capacity memory applications. Its combination of 8Gbit memory size, 1.866 GHz clock frequency, and 1.1V supply voltage makes it an excellent choice for modern electronic systems. The surface mount compatibility and ROHS3 compliance further enhance its suitability for a wide range of applications. While the product is now obsolete, its technical specifications and performance benefits continue to make it a valuable component for specific use cases.

Tech Specifications

Clock Frequency
PPAP
Data Bus Width (bit)
Number of Internal Banks
Memory Type
Product Status
Automotive
Supplier Package
DRAM Type
Chip Density (bit)
Number of Words per Bank
Package / Case
Technology
Voltage - Supply
Maximum Clock Rate (MHz)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
Number of I/O Lines (bit)
Memory Interface
ECCN
Memory Organization
Mounting Type
Standard Package Name
Pin Count
Mounting
Memory Size
Lead Shape
Typical Operating Supply Voltage (V)
HTSUS
Package
Organization
PCB changed
HTS
ECCN (US)
Supplier Device Package
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Process Technology
Package Height
Mfr
Memory Format
RoHS Status
Number of Bits/Word (bit)
Package Length
Series
Write Cycle Time - Word, Page
Part Status
Package Width
Base Product Number
Mounting Style
Unit Weight
Data Bus Width
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Type
Moisture Sensitive
Maximum Clock Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS

MT53E256M32D2DS-053 WT:B Documents

Download datasheets and manufacturer documentation for MT53E256M32D2DS-053 WT:B

Ersa Product Discontinuation Notification (PDF)      
Ersa Product Change Notification (PDF)      

Shopping Guide

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