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Heat Sinks
(163 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 015191Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
015536Heat Sinks | congatec | Standard Heat spreader for Qseven Module conga-QA5 with Open Silicon Pentium and Celeron processor | In Stock | - | |
015537Heat Sinks | congatec | Standard Heat spreader for Qseven Module Conga-QA5 with Open Silicon Pentium and Celeron processor | In Stock | - | |
016162Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
42051Heat Sinks | congatec | Standard Heat Spreader for COM Express module | In Stock | - | |
47352Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
47750Heat Sinks | congatec | Heat Sink Passive | In Stock | - | |
016160Heat Sinks | congatec | Standard Heat Spreader | In Stock | - | |
 CONGA-SA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 6 | - | |
 CONGA-PA7/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole | 1 | - | |
 CONGA-B7E3/SP4-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all dual die die variants. | In Stock | - | |
 B7XI/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | In Stock | - | |
 CONGA-MA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-QA3/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-STDA4/CSP-BCONGA-STDA4/CSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM | In Stock | - | |
 CONGA-QMX8/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole. | In Stock | - | |
 CONGA-MA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express Type 10 modules conga-MA3 and MA3E with fins. All standoffs are M2.5mm thread. | In Stock | - | |
 CONGA-TCA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-TC700/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | In Stock | - | |
 CONGA-TCA7/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5mm thread. | In Stock | - | |
CONGA-STDA4/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM | In Stock | - | |
 CONGA-MA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
 CONGA-TS570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | In Stock | - | |
CONGA-QA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | In Stock | - |
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