AMD_XC3S1400AN-4FGG484C
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AMD
XC3S1400AN-4FGG484C

696-XC3S1400AN-4FGG484C
IC FPGA 372 I/O 484FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A991D
Number of I/O
372
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
484-FBGA (23x23)
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XC3S1400AN-4FGG484C Description

The XC3S1400AN-4FGG484C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device belongs to the Spartan-3AN series, which is known for its low power consumption, high performance, and versatility.

Description:

The XC3S1400AN-4FGG484C is a high-density FPGA that is designed for a wide range of applications, including embedded systems, digital signal processing, and communication systems. It features a compact 484-pin flip-chip ball grid array (FCBGA) package, which allows for high-density integration and ease of use in various system designs.

Features:

  1. High-density architecture: The XC3S1400AN-4FGG484C offers a high-density architecture with up to 1,400 logic cells, providing ample resources for complex designs.
  2. Low power consumption: The device is designed for low power operation, making it suitable for battery-powered and energy-efficient applications.
  3. High-performance clocking: The FPGA features a high-performance clocking architecture, supporting up to 16 clock domains and providing flexible clock management options.
  4. Embedded memory: The XC3S1400AN-4FGG484C includes 360 Kbits of block RAM (BRAM) and 1152 Kbits of distributed RAM, providing ample memory resources for data storage and processing.
  5. I/O capabilities: The device offers a wide range of I/O options, including LVCMOS, 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V I/O standards, making it compatible with various industry-standard interfaces.
  6. Security features: The FPGA includes security features such as bitstream encryption and secure device configuration, ensuring the protection of intellectual property and system integrity.

Applications:

The XC3S1400AN-4FGG484C is suitable for a wide range of applications due to its high-density architecture, low power consumption, and versatile I/O capabilities. Some potential applications include:

  1. Embedded systems: The device can be used in various embedded systems, such as industrial control, automotive electronics, and consumer devices, where high performance and low power consumption are critical.
  2. Digital signal processing: The FPGA's high-density architecture and embedded memory make it suitable for digital signal processing applications, such as audio and video processing, image processing, and communication systems.
  3. Communication systems: The XC3S1400AN-4FGG484C can be used in communication systems, such as base stations, routers, and switches, where high-speed data processing and flexible I/O interfaces are required.
  4. Networking equipment: The device's versatile I/O capabilities and high-performance clocking make it suitable for networking equipment, such as Ethernet switches, firewalls, and intrusion detection systems.
  5. Military and aerospace: The FPGA's security features and reliability make it suitable for military and aerospace applications, where robustness and protection of intellectual property are essential.

In summary, the AMD XC3S1400AN-4FGG484C is a high-density, low-power FPGA that offers a wide range of features and applications, making it an ideal choice for various industries and applications requiring high performance, low power consumption, and versatile I/O capabilities.

FAQ

What is the mounting type of XC3S1400AN-4FGG484C?
XC3S1400AN-4FGG484C uses a Surface Mount mounting style based on the listed product specifications.
Is XC3S1400AN-4FGG484C currently in stock?
What voltage specification is listed for XC3S1400AN-4FGG484C?
What package or case is XC3S1400AN-4FGG484C available in?
What operating temperature range does XC3S1400AN-4FGG484C support?
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