onsemi_FDN335N
FDN335N(1)
FDN335N(2)
FDN335N(3)

onsemi
FDN335N  
Single FETs, MOSFETs

onsemi
FDN335N
278-FDN335N
Ersa
onsemi-FDN335N-datasheets-9298050.pdf
MOSFET N-CH 20V 1.7A SUPERSOT3
In Stock : 76172

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FDN335N Description

FDN335N Description

The FDN335N from onsemi is an N-channel PowerTrench® MOSFET designed for high-efficiency power management in compact applications. With a 20V drain-to-source voltage (Vdss) and 1.7A continuous drain current (Id), it offers robust performance in low-voltage circuits. The device leverages MOSFET (Metal Oxide) technology, ensuring low on-resistance (Rds(on) of 70mOhm @ 1.7A, 4.5V) and fast switching characteristics, making it ideal for power-sensitive designs. Packaged in a SUPERSOT3 form factor, it is optimized for surface-mount applications where space and thermal efficiency are critical.

FDN335N Features

  • Low Gate Charge (Qg): 5nC @ 4.5V minimizes switching losses, enhancing efficiency in high-frequency applications.
  • Low Input Capacitance (Ciss): 310pF @ 10V reduces drive requirements and improves transient response.
  • Wide Drive Voltage Range: Operates efficiently at 2.5V to 4.5V, compatible with low-voltage logic.
  • Thermally Efficient: 500mW power dissipation (Ta) ensures reliable operation under moderate loads.
  • Robust Protection: ±8V maximum gate-source voltage (Vgs) safeguards against voltage spikes.
  • Industry-Standard Compliance: ROHS3, REACH Unaffected, ECCN EAR99, and MSL1 (Unlimited) for global usability.

FDN335N Applications

The FDN335N excels in:

  • DC-DC Converters: Optimized for synchronous buck/boost topologies due to low Rds(on) and fast switching.
  • Load Switching: Ideal for portable devices (e.g., smartphones, tablets) where space and efficiency are paramount.
  • Battery Management: Low Vgs(th) (1.5V @ 250µA) enables precise control in power path protection circuits.
  • Motor Drivers: Suitable for small brushed DC motors in robotics or consumer electronics.
  • Power Distribution: Used in hot-swap and OR-ing applications thanks to its low conduction losses.

Conclusion of FDN335N

The FDN335N stands out as a high-performance, space-efficient MOSFET for modern low-power applications. Its PowerTrench® technology, combined with low gate charge and on-resistance, ensures superior efficiency in switching circuits. Whether for portable electronics, power supplies, or motor control, this MOSFET delivers reliability and thermal performance in a compact SUPERSOT3 package. Its compliance with environmental and industry standards further solidifies its suitability for global designs.

Tech Specifications

FET Type
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
Product Status
Supplier Device Package
Drain to Source Voltage (Vdss)
Power Dissipation (Max)
Package / Case
Technology
REACH Status
Mfr
Vgs (Max)
RoHS Status
Moisture Sensitivity Level (MSL)
Operating Temperature
FET Feature
ECCN
Mounting Type
Rds On (Max) @ Id, Vgs
Vgs(th) (Max) @ Id
Series
Current - Continuous Drain (Id) @ 25°C
Drive Voltage (Max Rds On, Min Rds On)
HTSUS
Package
Base Product Number
Configuration
Typical Turn-Off Delay Time (ns)
Maximum Gate Source Leakage Current (nA)
Typical Rise Time (ns)
PPAP
Channel Mode
Typical Turn-On Delay Time (ns)
Automotive
Supplier Package
Maximum IDSS (uA)
Channel Type
EU RoHS
Maximum Continuous Drain Current (A)
Maximum Pulsed Drain Current @ TC=25°C (A)
Maximum Drain Source Voltage (V)
Maximum Drain Source Resistance (mOhm)
Standard Package Name
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
Pin Count
Mounting
Minimum Gate Threshold Voltage (V)
Typical Reverse Transfer Capacitance @ Vds (pF)
Lead Shape
Typical Gate to Drain Charge (nC)
Typical Gate Charge @ Vgs (nC)
Typical Input Capacitance @ Vds (pF)
Maximum Power Dissipation on PCB @ TC=25°C (W)
Category
PCB changed
HTS
Number of Elements per Chip
ECCN (US)
Maximum Power Dissipation (mW)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Typical Fall Time (ns)
Process Technology
Package Height
Typical Gate to Source Charge (nC)
Maximum Positive Gate Source Voltage (V)
Typical Drain Source Resistance @ 25°C (mOhm)
Typical Gate Threshold Voltage (V)
Maximum Gate Source Voltage (V)
Typical Gate Plateau Voltage (V)
Package Length
Typical Gate Charge @ 10V (nC)
Maximum Diode Forward Voltage (V)
Typical Diode Forward Voltage (V)
Operating Junction Temperature (°C)
Typical Output Capacitance (pF)
Part Status
Maximum Gate Threshold Voltage (V)
Package Width
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)

FDN335N Documents

Download datasheets and manufacturer documentation for FDN335N

Ersa Mult Dev Site Chgs 2/Oct/2020      
Ersa FDN335N Datasheet      
Ersa Mult Devices 24/Oct/2017       Binary Year Code Marking 15/Jan/2014      
Ersa Marking Lay-out Implementation 15/Nov/2021       Marking Lay-out Implementation 07/Oct/2022      
Ersa onsemi RoHS       Material Declaration FDN335N      

Shopping Guide

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Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
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